Inventor · disambiguated record
Ju-Ming Huang
Also filed as: HUANG JU-MING
7 granted patents·1 pending application·0 citations·filing 2017–2019
67Inventor score
Files withTAIWAN UNION TECHNOLOGY CORP8
Top patents by PatentIndex Score
8 records- 0155US11414532B2Resin composition, and prepreg, metal-clad laminate, and printed circuit board using the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2018·Granted Aug 16, 2022·0 cites·14 claims
- 0255US11001759B2Resin composition, and pre-preg, metal-clad laminate, and printed circuit board prepared using the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2018·Granted May 11, 2021·0 cites·14 claims
- 0352US11339258B2Resin composition, and pre-preg, metal-clad laminate and printed circuit board prepared using the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2018·Granted May 24, 2022·0 cites·17 claims
- 0450US10920008B2Thermal-curable resin composition, and pre-preg, metal-clad laminate and printed circuit board manufactured using the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2019·Granted Feb 16, 2021·0 cites·16 claims
- 0549US10994516B2Resin composition, and pre-preg, metal-clad laminate and printed circuit board prepared using the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2018·Granted May 4, 2021·0 cites·11 claims
- 0648US11643544B2Resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2018·Granted May 9, 2023·0 cites·10 claims
- 0745US10563006B2Resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2017·Granted Feb 18, 2020·0 cites·12 claims
- 0834US2018312627A1Resin Composition, Prepreg, Metal-Clad Laminate, and Printed Circuit Board Using the SameTAIWAN UNION TECHNOLOGY CORP·Filed 2017·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →