Inventor · disambiguated record
Yan-Ting Shen
Also filed as: SHEN YAN · SHEN YAN-TING
7 granted patents·5 pending applications·4 citations·filing 2010–2025
74Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD5ADVANCED SEMICONDUCTOR ENG4HEFEI INST OF PHYSICAL SCIENCE CAS1QUADRANT INT INC1WU SHU-YII1
Top patents by PatentIndex Score
12 records- 0187US11587809B2Wafer supporting mechanism and method for wafer dicingADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Feb 21, 2023·2 cites·12 claims
- 0282US11430893B2Method of manufacturing a semiconductor device and a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 30, 2022·1 cites·20 claims
- 0377US2024297253A1Method of manufacturing a semiconductor device and a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0475US12015085B2Method of manufacturing a semiconductor device including etching polysiliconTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 18, 2024·0 cites·20 claims
- 0572US12112965B2Wafer supporting mechanism and method for wafer dicingADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Oct 8, 2024·0 cites·17 claims
- 0669US12243929B2Forming a dummy gate structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 4, 2025·0 cites·20 claims
- 0766US2025194200A1Semiconductor device and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0864US2025258247A1Dynamic time warping (dtw)-based real-time diagnosis method for commutation failure (cf) of phase-controlled converterHEFEI INST OF PHYSICAL SCIENCE CAS·Filed 2025·Application pending·0 cites
- 0962US8080589B2Method for producing a bio-based polymeric shoe componentWU SHU-YII·Filed 2010·Granted Dec 20, 2011·1 cites·19 claims
- 1050US2025132079A1Magnetic devices with localized demagnetization and methods of assembling the sameQUADRANT INT INC·Filed 2022·Application pending·0 cites
- 1142US2023037117A1Method of manufacturing semiconductor structureADVANCED SEMICONDUCTOR ENG·Filed 2021·Application pending·0 cites
- 1240US11189518B2Method of processing a semiconductor waferADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Nov 30, 2021·0 cites·14 claims
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