Inventor · disambiguated record
Katsuyuki Inoue
Also filed as: INOUE KATSUYUKI
10 granted patents·35 citations·filing 2002–2021
86Inventor score
Top patents by PatentIndex Score
10 records- 0178US8188556B2Semiconductor sensor and method of manufacturing the sameADACHI YOSHITAKA·Filed 2010·Granted May 29, 2012·9 cites·2 claims
- 0277US8975736B2Wafer level package, chip size package device and method of manufacturing wafer level packageOKUNO TOSHIAKI·Filed 2011·Granted Mar 10, 2015·6 cites·20 claims
- 0370US7124417B2Attaching and detaching mechanismSONY CORP·Filed 2005·Granted Oct 17, 2006·1 cites·1 claims
- 0466US6904606B2Attaching and detaching mechanism for a front operating panel of a vehicle-mounted audio unitSONY CORP·Filed 2002·Granted Jun 7, 2005·9 cites·5 claims
- 0564US6971112B2Attaching and detaching mechanismSONY CORP·Filed 2005·Granted Nov 29, 2005·2 cites·1 claims
- 0662US6820036B2Monitoring systemMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Nov 16, 2004·8 cites·11 claims
- 0752US12157157B2Pressing machine and pressed product manufacturing methodASAHI SEIKI MFG·Filed 2021·Granted Dec 3, 2024·0 cites·22 claims
- 0852US7007287B2Attaching and detaching mechanismSONY CORP·Filed 2005·Granted Feb 28, 2006·0 cites·1 claims
- 0952US6971113B2Attaching and detaching mechanismSONY CORP·Filed 2005·Granted Nov 29, 2005·0 cites·1 claims
- 1039US9136232B2Method for bonding wafers and structure of bonding partOMRON TATEISI ELECTRONICS CO·Filed 2012·Granted Sep 15, 2015·0 cites·13 claims
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