Inventor · disambiguated record
Chien-Cheng Lee
Also filed as: LEE CHIEN-CHENG
14 granted patents·9 pending applications·19 citations·filing 2012–2025
85Inventor score
Top patents by PatentIndex Score
23 records- 0191US9860990B1Circuit board structure with chips embedded therein and manufacturing method thereofBOARDTEK ELECTRONICS CORP·Filed 2016·Granted Jan 2, 2018·14 cites·7 claims
- 0281US11963293B2Circuit board structure with waveguide and method for manufacturing the sameBOARDTEK ELECTRONICS CORP·Filed 2021·Granted Apr 16, 2024·1 cites·19 claims
- 0381US11678431B2Circuit board having waveguides and method of manufacturing the sameBOARDTEK ELECTRONICS CORP·Filed 2021·Granted Jun 13, 2023·1 cites·14 claims
- 0478US2025372501A1Circuit board moduleBOARDTEK ELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0568US11063333B2Multilayer electromagnetic wave transmission board assembled by an adhesive and including a barrier to block the adhesive from flowing into a waveguide channelBOARDTEK ELECTRONICS CORP·Filed 2019·Granted Jul 13, 2021·1 cites·2 claims
- 0665US12424536B2Packaging structure with embedded power chip and circuit board module having the sameBOARDTEK ELECTRONICS CORP·Filed 2022·Granted Sep 23, 2025·0 cites·7 claims
- 0762US9392687B2Circuit boardBOARDTEK ELECTRONICS CORP·Filed 2015·Granted Jul 12, 2016·1 cites·10 claims
- 0861US9271387B2Circuit board structure manufacturing methodBOARDTEK ELECTRONICS CORP·Filed 2013·Granted Feb 23, 2016·1 cites·11 claims
- 0953US12489076B2Power module for high-frequency use and method for manufacturing the sameBOARDTEK ELECTRONICS CORP·Filed 2022·Granted Dec 2, 2025·0 cites·8 claims
- 1053US9320139B2Circuit board having interior spaceBOARDTEK ELECTRONICS CORP·Filed 2014·Granted Apr 19, 2016·0 cites·12 claims
- 1151US11803022B2Circuit board structure with waveguide and method for manufacturing the sameBOARDTEK ELECTRONICS CORP·Filed 2021·Granted Oct 31, 2023·0 cites·11 claims
- 1249US2016095197A1Circuit board module and circuit board structureBOARDTEK ELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 1347US2015008029A1Circuit board and method of manufacturing the sameBOARDTEK ELECTRONICS CORP·Filed 2013·Application pending·0 cites
- 1444US2014124124A1Printed circuit board manufacturing methodBOARDTEK ELECTRONICS CORP·Filed 2012·Application pending·0 cites
- 1544US2014123487A1Printed circuit board manufacturing methodBOARDTEK ELECTRONICS CORP·Filed 2012·Application pending·0 cites
- 1643US9826642B1Circuit board structure and manufacturing method thereofBOARDTEK ELECTRONICS CORP·Filed 2016·Granted Nov 21, 2017·0 cites·6 claims
- 1742US2020107456A1Circuit board structureBOARDTEK ELECTRONICS CORP·Filed 2019·Application pending·0 cites
- 1842US2015271325A1Method for non-contact incoming call rejection and communication system using the sameUNIV YUAN ZE·Filed 2014·Application pending·0 cites
- 1941US11129283B2Method of electroplating a circuit boardBOARDTEK ELECTRONICS CORP·Filed 2019·Granted Sep 21, 2021·0 cites·11 claims
- 2041US2020128680A1Circuit board and plating method thereofBOARDTEK ELECTRONICS CORP·Filed 2018·Application pending·0 cites
- 2138US9661760B2Printed circuit board and manufacturing method thereofBOARDTEK ELECTRONICS CORP·Filed 2015·Granted May 23, 2017·0 cites·7 claims
- 2236US9675278B2Body rehabilitation sensing method based on a mobile communication device and a system thereofUNIV YUAN ZE·Filed 2015·Granted Jun 13, 2017·0 cites·10 claims
- 2335US2017293978A1Customizable information system and related methodSOUNDER TECH INC·Filed 2016·Application pending·0 cites
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