Inventor · disambiguated record
Shigeru Michiwaki
Also filed as: MICHIWAKI SHIGERU
12 granted patents·1 pending application·65 citations·filing 1986–2018
88Inventor score
Top patents by PatentIndex Score
13 records- 0190US10385076B2Surface treatment agent and novel compoundMORI KUNIO·Filed 2017·Granted Aug 20, 2019·8 cites·1 claims
- 0284US9790242B2Surface treatment method, surface treatment agent, and novel compoundMORI KUNIO·Filed 2012·Granted Oct 17, 2017·5 cites·7 claims
- 0381US10244624B2Three-dimensional wiring board production method, three-dimensional wiring board, and substrate for three-dimensional wiring boardMEIKO ELECTRONICS CO LTD·Filed 2015·Granted Mar 26, 2019·3 cites·7 claims
- 0477US6841738B2Printed wiring board having rigid portion and flexible portion, and method of fabricating the boardVICTOR COMPANY OF JAPAN·Filed 2003·Granted Jan 11, 2005·32 cites·8 claims
- 0575US7800917B2Printed wiring boardMEIKO ELECTRONICS CO LTD·Filed 2006·Granted Sep 21, 2010·8 cites·2 claims
- 0662US8753748B2Process for forming metal film, and product equipped with metal filmMORI KUNIO·Filed 2011·Granted Jun 17, 2014·0 cites·30 claims
- 0761US10537021B2Three-dimensional wiring board production method, three-dimensional wiring board, and substrate for three-dimensional wiring boardMEIKO ELECTRONICS CO LTD·Filed 2018·Granted Jan 14, 2020·0 cites·10 claims
- 0860US9593423B2Process for forming metal film, and product equipped with metal filmMORI KUNIO·Filed 2014·Granted Mar 14, 2017·1 cites·12 claims
- 0946US4758916AMulti-head transducer assembly for helical scan video tape recordersVICTOR COMPANY OF JAPAN·Filed 1986·Granted Jul 19, 1988·7 cites·2 claims
- 1041US6704208B2Printed circuit board and manufacturing method thereofVICTOR COMPANY OF JAPAN·Filed 2002·Granted Mar 9, 2004·1 cites·4 claims
- 1139US9185811B2Method of producing printed circuit board, and printed board produced by the methodSAITO YOICHI·Filed 2011·Granted Nov 10, 2015·0 cites·3 claims
- 1233US2002171530A1Production method of thin film passive element formed on printed circuit board and thin film passive element produced by the methodVICTOR COMPANY OF JAPAN·Filed 2002·Application pending·0 cites
- 1325US9380711B2Substrate manufacturing methodTAKII SHUKICHI·Filed 2011·Granted Jun 28, 2016·0 cites·4 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →