Inventor · disambiguated record
Yat Kit Tsui
Also filed as: TSUI YAT KIT
5 granted patents·12 citations·filing 2010–2015
70Inventor score
Top patents by PatentIndex Score
5 records- 0178US8232626B2Via and method of via forming and method of via fillingTSUI YAT KIT·Filed 2010·Granted Jul 31, 2012·7 cites·22 claims
- 0266US8754507B2Forming through-silicon-vias for multi-wafer integrated circuitsXIE BIN·Filed 2011·Granted Jun 17, 2014·3 cites·20 claims
- 0365US9713284B2Locally enhanced direct liquid cooling system for high power applicationsHONG KONG APPLIED SCIENCE AND TECH RES INST CO LTD·Filed 2015·Granted Jul 18, 2017·2 cites·20 claims
- 0453US8823126B2Low cost backside illuminated CMOS image sensor package with high integrationYANG DAN·Filed 2012·Granted Sep 2, 2014·0 cites·14 claims
- 0535US9117715B2Wafer-level device packagingTSUI YAT KIT·Filed 2012·Granted Aug 25, 2015·0 cites·12 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →