Inventor · disambiguated record
Gene Wu
Also filed as: WU GENE · WU GENE KAI JINN
5 granted patents·3 pending applications·136 citations·filing 2006–2025
80Inventor score
Top patents by PatentIndex Score
8 records- 0196US7838424B2Enhanced reliability of wafer-level chip-scale packaging (WLCSP) die separation using dry etchingTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Nov 23, 2010·84 cites·20 claims
- 0292US7830004B2Packaging with base layers comprising alloy 42TAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Nov 9, 2010·44 cites·23 claims
- 0391US12224940B2Selective congestion notification by a network interface deviceINTEL CORP·Filed 2021·Granted Feb 11, 2025·5 cites·22 claims
- 0465US7642129B2Ball-mounting method for coplanarity improvement in large packageTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Jan 5, 2010·3 cites·14 claims
- 0559US2025279962A1Selective congestion notification by a network interface deviceINTEL CORP·Filed 2025·Application pending·0 cites
- 0649US2012273373A1Single-Use Ergonomic ChaliceWU GENE KAI JINN·Filed 2012·Application pending·0 cites
- 0742US2008131996A1Reverse build-up process for fine bump pitch approachWU GENE·Filed 2006·Application pending·0 cites
- 0839US10250524B2Technologies for increasing bandwidth in partitioned hierarchical networksINTEL CORP·Filed 2016·Granted Apr 2, 2019·0 cites·25 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →