Inventor · disambiguated record
Ryutaro Date
Also filed as: DATE RYUTARO
12 granted patents·1 pending application·64 citations·filing 2013–2020
86Inventor score
Technology areasH10W
Files withMITSUBISHI ELECTRIC CORP13
Top patents by PatentIndex Score
13 records- 0188USD798832SPower semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Oct 3, 2017·35 cites·1 claims
- 0282USD790491SPower semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Jun 27, 2017·23 cites·1 claims
- 0381US11063025B2Semiconductor module and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Jul 13, 2021·4 cites·20 claims
- 0465US10748830B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Aug 18, 2020·1 cites·10 claims
- 0545US2023170323A1Semiconductor device, power converter, moving vehicle, and semiconductor device manufacturing methodMITSUBISHI ELECTRIC CORP·Filed 2020·Application pending·0 cites
- 0644US10804253B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Oct 13, 2020·0 cites·6 claims
- 0744US9585279B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2013·Granted Feb 28, 2017·0 cites·7 claims
- 0843US10483175B2Power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Nov 19, 2019·0 cites·7 claims
- 0943US10325827B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2013·Granted Jun 18, 2019·0 cites·20 claims
- 1038US11488896B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Nov 1, 2022·0 cites·17 claims
- 1138US10361136B2Semiconductor device and semiconductor module provided with sameMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Jul 23, 2019·0 cites·18 claims
- 1236US10224257B2Semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Mar 5, 2019·0 cites·14 claims
- 1333USD827590SPower semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Sep 4, 2018·1 cites·1 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →