Inventor · disambiguated record
Darryl J. Becker
Also filed as: BECKER DARRYL · BECKER DARRYL J · BECKER DARRYL JOHN
115 granted patents·13 pending applications·616 citations·filing 1993–2021
99Inventor score
Top patents by PatentIndex Score
128 records- 0195US9739825B2Residual material detection in backdrilled stubsIBM·Filed 2016·Granted Aug 22, 2017·6 cites·16 claims
- 0293US9488690B2Residual material detection in backdrilled stubsIBM·Filed 2014·Granted Nov 8, 2016·8 cites·10 claims
- 0393US9341670B2Residual material detection in backdrilled stubsIBM·Filed 2014·Granted May 17, 2016·13 cites·10 claims
- 0492US7342816B2Daisy chainable memory chipIBM·Filed 2006·Granted Mar 11, 2008·27 cites·20 claims
- 0589US9438606B1Environmental-based location monitoringIBM·Filed 2015·Granted Sep 6, 2016·5 cites·1 claims
- 0689US7952478B2Capacitance-based microchip exploitation detectionIBM·Filed 2008·Granted May 31, 2011·20 cites·20 claims
- 0788US7884625B2Capacitance structures for defeating microchip tamperingIBM·Filed 2008·Granted Feb 8, 2011·16 cites·20 claims
- 0887US5905636AHeat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic deviceIBM·Filed 1998·Granted May 18, 1999·72 cites·9 claims
- 0986US10318462B2Secure crypto module including optical glass security layerIBM·Filed 2016·Granted Jun 11, 2019·4 cites·16 claims
- 1085US5745344AHeat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic deviceIBM·Filed 1995·Granted Apr 28, 1998·67 cites·12 claims
- 1184US10499744B2Removable back restKASPAR WIRE WORKS INC·Filed 2016·Granted Dec 10, 2019·5 cites·7 claims
- 1284US10171498B2Secure crypto module including electrical shorting security layersIBM·Filed 2016·Granted Jan 1, 2019·3 cites·10 claims
- 1384US7202685B1Embedded probe-enabling socket with integral probe structuresIBM·Filed 2005·Granted Apr 10, 2007·12 cites·9 claims
- 1483US8519304B2Implementing selective rework for chip stacks and silicon carrier assembliesBARTLEY GERALD KEITH·Filed 2010·Granted Aug 27, 2013·6 cites·9 claims
- 1583US7838336B2Method and structure for dispensing chip underfill through an opening in the chipIBM·Filed 2007·Granted Nov 23, 2010·10 cites·6 claims
- 1682US10157527B1Embossed printed circuit board for intrusion detectionIBM·Filed 2017·Granted Dec 18, 2018·3 cites·18 claims
- 1782US8466024B2Power domain controller with gated through silicon via having FET with horizontal channelBARTLEY GERALD K·Filed 2010·Granted Jun 18, 2013·6 cites·2 claims
- 1882US7675164B2Method and structure for connecting, stacking, and cooling chips on a flexible carrierIBM·Filed 2007·Granted Mar 9, 2010·10 cites·15 claims
- 1982US7345900B2Daisy chained memory systemIBM·Filed 2006·Granted Mar 18, 2008·13 cites·22 claims
- 2082US6261404B1Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic deviceIBM·Filed 1999·Granted Jul 17, 2001·52 cites·13 claims
- 2181US7074050B1Socket assembly with incorporated memory structureIBM·Filed 2005·Granted Jul 11, 2006·19 cites·14 claims
- 2280US11061846B2Secure crypto module including electrical shorting security layersIBM·Filed 2018·Granted Jul 13, 2021·2 cites·10 claims
- 2380US10025751B2Dynamic clock lane assignment for increased performance and securityIBM·Filed 2016·Granted Jul 17, 2018·2 cites·13 claims
- 2480US8823090B2Field-effect transistor and method of creating sameBARTLEY GERALD K·Filed 2011·Granted Sep 2, 2014·5 cites·11 claims
- 2580US7345901B2Computer system having daisy chained self timed memory chipsIBM·Filed 2006·Granted Mar 18, 2008·12 cites·20 claims
- 2679US10481496B2Forming conductive vias using a light guideIBM·Filed 2017·Granted Nov 19, 2019·2 cites·21 claims
- 2779US7701244B2False connection for defeating microchip exploitationIBM·Filed 2008·Granted Apr 20, 2010·8 cites·20 claims
- 2877US7954081B2Implementing enhanced wiring capability for electronic laminate packagesIBM·Filed 2008·Granted May 31, 2011·6 cites·10 claims
- 2977US6993739B2Method, structure, and computer program product for implementing high frequency return current paths within electronic packagesIBM·Filed 2003·Granted Jan 31, 2006·23 cites·18 claims
- 3076US9310827B2Multiple active vertically aligned cores for three-dimensional chip stackIBM·Filed 2014·Granted Apr 12, 2016·3 cites·9 claims
- 3176US7088200B2Method and structure to control common mode impedance in fan-out regionsIBM·Filed 2004·Granted Aug 8, 2006·11 cites·13 claims
- 3275US8079134B2Method of enhancing on-chip inductance structure utilizing silicon through via technologyMAKI ANDREW BENSON·Filed 2008·Granted Dec 20, 2011·9 cites·1 claims
- 3374US9665736B2Authentication using optically sensed relative positionIBM·Filed 2014·Granted May 30, 2017·2 cites·5 claims
- 3474US9003559B2Continuity check monitoring for microchip exploitation detectionBARTLEY GERALD K·Filed 2008·Granted Apr 7, 2015·6 cites·18 claims
- 3574US7725762B2Implementing redundant memory access using multiple controllers on the same bank of memoryIBM·Filed 2007·Granted May 25, 2010·6 cites·17 claims
- 3674US7667487B2Techniques for providing switchable decoupling capacitors for an integrated circuitIBM·Filed 2008·Granted Feb 23, 2010·6 cites·19 claims
- 3774US7627711B2Memory controller for daisy chained memory chipsIBM·Filed 2006·Granted Dec 1, 2009·6 cites·5 claims
- 3873US10547640B1Secure crypto module including electrical shorting security layersIBM·Filed 2018·Granted Jan 28, 2020·1 cites·12 claims
- 3973US8172140B2Doped implant monitoring for microchip tamper detectionBARTLEY GERALD K·Filed 2008·Granted May 8, 2012·5 cites·20 claims
- 4073US8108647B2Digital data architecture employing redundant links in a daisy chain of component modulesBARTLEY GERALD KEITH·Filed 2009·Granted Jan 31, 2012·6 cites·20 claims
- 4173US7480201B2Daisy chainable memory chipIBM·Filed 2007·Granted Jan 20, 2009·8 cites·1 claims
- 4271US7673093B2Computer system having daisy chained memory chipsIBM·Filed 2006·Granted Mar 2, 2010·5 cites·1 claims
- 4371US7546410B2Self timed memory chip having an apportionable data busIBM·Filed 2006·Granted Jun 9, 2009·5 cites·3 claims
- 4470US9568940B2Multiple active vertically aligned cores for three-dimensional chip stackIBM·Filed 2013·Granted Feb 14, 2017·2 cites·9 claims
- 4570US9281261B2Intelligent chip placement within a three-dimensional chip stackIBM·Filed 2014·Granted Mar 8, 2016·2 cites·2 claims
- 4670US7553696B2Method for implementing component placement suspended within grid array packages for enhanced electrical performanceIBM·Filed 2006·Granted Jun 30, 2009·4 cites·7 claims
- 4770US7402912B2Method and power control structure for managing plurality of voltage islandsIBM·Filed 2005·Granted Jul 22, 2008·3 cites·3 claims
- 4868US11864327B2Creating inductors, resistors, capacitors and other structures in printed circuit board vias with light pipe technologyIBM·Filed 2020·Granted Jan 2, 2024·0 cites·11 claims
- 4968US9887840B2Scrambling bit transmissionsIBM·Filed 2015·Granted Feb 6, 2018·1 cites·20 claims
- 5068US8174103B2Enhanced architectural interconnect options enabled with flipped die on a multi-chip packageBARTLEY GERALD KEITH·Filed 2008·Granted May 8, 2012·4 cites·1 claims
Showing the top 50 of 128 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →