Inventor · disambiguated record
Hidetoshi Arimura
Also filed as: ARIMURA HIDETOSHI
5 granted patents·5 pending applications·25 citations·filing 2007–2022
72Inventor score
Top patents by PatentIndex Score
10 records- 0187US8404160B2Metallic inkLI YUNJUN·Filed 2009·Granted Mar 26, 2013·11 cites·24 claims
- 0284US8506849B2Additives and modifiers for solvent- and water-based metallic conductive inksLI XUEPING·Filed 2009·Granted Aug 13, 2013·14 cites·2 claims
- 0357US2025001054A1Bone joint material, and method for producing bone joint materialGUNZE KK·Filed 2022·Application pending·0 cites
- 0456US2009171064A1Bio-degradable/ absorbable polymer having reduced metal catalyst content, and process for production thereofGUNZE KK·Filed 2007·Application pending·0 cites
- 0554US8481673B2Bio-degradable/absorbable polymer having reduced metal catalyst content, and process for production thereofGUNZE KK·Filed 2012·Granted Jul 9, 2013·0 cites·16 claims
- 0650US10765780B2Method of producing tissue regeneration substrateGUNZE KK·Filed 2015·Granted Sep 8, 2020·0 cites·4 claims
- 0744US2016029483A1Copper particulate dispersion, conductive film forming method, and circuit boardISHIHARA CHEMICAL CO LTD·Filed 2014·Application pending·0 cites
- 0844US2016007455A1Copper particulate dispersion, conductive film forming method, and circuit boardISHIHARA CHEMICAL CO LTD·Filed 2014·Application pending·0 cites
- 0943US2015240028A1Biodegradable polymer compoundGUNZE KK·Filed 2013·Application pending·0 cites
- 1041US9642934B2Bone regeneration material kit, paste-like bone regeneration material, bone regeneration material, and bone bonding materialGUNZE KK·Filed 2014·Granted May 9, 2017·0 cites·7 claims
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