Inventor · disambiguated record
Jaepil Kim
Also filed as: KIM JAEPIL
8 granted patents·1 pending application·15 citations·filing 2007–2024
79Inventor score
Files withLG DISPLAY CO LTD2NAVER BUSINESS PLATFORM CORP2SAMSUNG ELECTRONICS CO LTD2KIM JAEPIL1LEE HYE RAN1
Top patents by PatentIndex Score
9 records- 0181US10952346B2Rack having scalability and compatibilityNAVER BUSINESS PLATFORM CORP·Filed 2018·Granted Mar 16, 2021·6 cites·20 claims
- 0272US9006428B2High transmissional green dye for LCD and synthetic method thereofLG DISPLAY CO LTD·Filed 2012·Granted Apr 14, 2015·2 cites·14 claims
- 0368US8227903B2Integrated circuit packaging system with encapsulant containment and method of manufacture thereofLEE HYE RAN·Filed 2010·Granted Jul 24, 2012·3 cites·20 claims
- 0466US10356953B2Booth apparatus for supplying cooling airNAVER BUSINESS PLATFORM CORP·Filed 2014·Granted Jul 16, 2019·2 cites·3 claims
- 0562US11145290B2System including electronic device of processing user's speech and method of controlling speech recognition on electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 12, 2021·1 cites·20 claims
- 0661US2025257218A1Compositions for near-infrared light-blocking filters, and image sensors including near-infrared light-blocking filtersSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0747US8822690B2High transmissional yellow dye for LCD and synthetic method thereofLG DISPLAY CO LTD·Filed 2012·Granted Sep 2, 2014·0 cites·16 claims
- 0846US9129978B1Integrated circuit packaging system with void prevention mechanism and method of manufacture thereofKIM JAEPIL·Filed 2014·Granted Sep 8, 2015·1 cites·10 claims
- 0937US7863761B2Integrated circuit package system with molding ventsSTATS CHIPPAC LTD·Filed 2007·Granted Jan 4, 2011·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →