Inventor · disambiguated record
Godfrey Dimayuga
Also filed as: DIMAYUGA GODFREY
6 granted patents·4 citations·filing 2014–2022
68Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0174US9824979B2Electronic package having electromagnetic interference shielding and associated methodST MICROELECTRONICS INC·Filed 2015·Granted Nov 21, 2017·4 cites·20 claims
- 0252US12266613B2Electronic device comprising a package provided with an interconnection structureST MICROELECTRONICS GRENOBLE 2·Filed 2022·Granted Apr 1, 2025·0 cites·10 claims
- 0351US11270894B2Manufacturing method for semiconductor package with cantilever padsST MICROELECTRONICS INC·Filed 2018·Granted Mar 8, 2022·0 cites·19 claims
- 0451US9899236B2Semiconductor package with cantilever padsST MICROELECTRONICS INC·Filed 2014·Granted Feb 20, 2018·0 cites·18 claims
- 0535US9627224B2Semiconductor device with sloped sidewall and related methodsST MICROELECTRONICS INC·Filed 2015·Granted Apr 18, 2017·0 cites·33 claims
- 0633US9768126B2Stacked semiconductor packages with cantilever padsST MICROELECTRONICS INC·Filed 2015·Granted Sep 19, 2017·0 cites·19 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →