Inventor · disambiguated record
Robert J. Wojnarowski
Also filed as: WOJNAROWSKI ROBERT · WOJNAROWSKI ROBERT J · WOJNAROWSKI ROBERT JOHN
145 granted patents·4 pending applications·14,546 citations·filing 1979–2009
99Inventor score
Top patents by PatentIndex Score
149 records- 0199US5353498AMethod for fabricating an integrated circuit moduleGEN ELECTRIC·Filed 1993·Granted Oct 11, 1994·1.2k cites·46 claims
- 0299US4783695AMultichip integrated circuit packaging configuration and methodGEN ELECTRIC·Filed 1986·Granted Nov 8, 1988·516 cites·10 claims
- 0399US4290052ACapacitive touch entry apparatus having high degree of personal safetyGEN ELECTRIC·Filed 1979·Granted Sep 15, 1981·341 cites·8 claims
- 0498US7276703B2System to monitor the health of a structure, sensor nodes, program product, and related methodsLOCKHEED CORP·Filed 2005·Granted Oct 2, 2007·100 cites·30 claims
- 0598US6635363B1Phosphor coating with self-adjusting distance from LED chipGEN ELECTRIC·Filed 2000·Granted Oct 21, 2003·262 cites·17 claims
- 0698US6046410AInterface structures for electronic devicesGEN ELECTRIC·Filed 1998·Granted Apr 4, 2000·141 cites·7 claims
- 0798US5888884AElectronic device pad relocation, precision placement, and packaging in arraysGEN ELECTRIC·Filed 1998·Granted Mar 30, 1999·303 cites·20 claims
- 0898US5527741AFabrication and structures of circuit modules with flexible interconnect layersMARTIN MARIETTA CORP·Filed 1994·Granted Jun 18, 1996·351 cites·13 claims
- 0998US5324687AMethod for thinning of integrated circuit chips for lightweight packaged electronic systemsGEN ELECTRIC·Filed 1992·Granted Jun 28, 1994·318 cites·15 claims
- 1098US5241456ACompact high density interconnect structureGEN ELECTRIC·Filed 1990·Granted Aug 31, 1993·466 cites·13 claims
- 1198US4933042AMethod for packaging integrated circuit chips employing a polymer film overlay layerGEN ELECTRIC·Filed 1988·Granted Jun 12, 1990·155 cites·14 claims
- 1298US4918811AMultichip integrated circuit packaging methodGEN ELECTRIC·Filed 1989·Granted Apr 24, 1990·245 cites·5 claims
- 1397US6452217B1High power LED lamp structure using phase change cooling enhancements for LED lighting productsGEN ELECTRIC·Filed 2000·Granted Sep 17, 2002·225 cites·18 claims
- 1497US6396153B2Circuit chip package and fabrication methodGEN ELECTRIC·Filed 2001·Granted May 28, 2002·163 cites·10 claims
- 1597US5900674AInterface structures for electronic devicesGEN ELECTRIC·Filed 1996·Granted May 4, 1999·168 cites·28 claims
- 1697US5703400AFabrication and structures of two-sided molded circuit modules with flexible interconnect layersGEN ELECTRIC·Filed 1996·Granted Dec 30, 1997·212 cites·9 claims
- 1797US5434751AReworkable high density interconnect structure incorporating a release layerMARTIN MARIETTA CORP·Filed 1994·Granted Jul 18, 1995·247 cites·17 claims
- 1897US5366906AWafer level integration and testingMARTIN MARIETTA CORP·Filed 1992·Granted Nov 22, 1994·196 cites·13 claims
- 1997US4894115ALaser beam scanning method for forming via holes in polymer materialsGEN ELECTRIC·Filed 1989·Granted Jan 16, 1990·259 cites·27 claims
- 2097US4835704AAdaptive lithography system to provide high density interconnectGEN ELECTRIC·Filed 1986·Granted May 30, 1989·191 cites·14 claims
- 2196US7262444B2Power semiconductor packaging method and structureGEN ELECTRIC·Filed 2005·Granted Aug 28, 2007·50 cites·21 claims
- 2296US6412971B1Light source including an array of light emitting semiconductor devices and control methodGEN ELECTRIC·Filed 1999·Granted Jul 2, 2002·255 cites·24 claims
- 2396US6242282B1Circuit chip package and fabrication methodGEN ELECTRIC·Filed 1999·Granted Jun 5, 2001·198 cites·20 claims
- 2496US5737458AOptical light pipe and microwave waveguide interconnects in multichip modules formed using adaptive lithographyMARTIN MARIETTA CORP·Filed 1995·Granted Apr 7, 1998·189 cites·8 claims
- 2596US5353195AIntegral power and ground structure for multi-chip modulesGEN ELECTRIC·Filed 1993·Granted Oct 4, 1994·238 cites·19 claims
- 2696US5161093AMultiple lamination high density interconnect process and structure employing a variable crosslinking adhesiveGEN ELECTRIC·Filed 1990·Granted Nov 3, 1992·246 cites·19 claims
- 2796US4780177AExcimer laser patterning of a novel resistGEN ELECTRIC·Filed 1988·Granted Oct 25, 1988·150 cites·34 claims
- 2895US7667375B2Broad band energy harvesting system and related methodsLOCKHEED CORP·Filed 2006·Granted Feb 23, 2010·36 cites·18 claims
- 2995US6747406B1LED cross-linkable phospor coatingGEN ELECTRIC·Filed 2000·Granted Jun 8, 2004·106 cites·18 claims
- 3095US6483196B1Flip chip led apparatusGEN ELECTRIC·Filed 2000·Granted Nov 19, 2002·150 cites·36 claims
- 3195US6407411B1Led lead frame assemblyGEN ELECTRIC·Filed 2000·Granted Jun 18, 2002·168 cites·31 claims
- 3295US6298551B1Methods of forming compliant interface structures with partially open interiors for coupling two electrically conductive contact areasGEN ELECTRIC·Filed 1999·Granted Oct 9, 2001·79 cites·14 claims
- 3395US6092280AFlexible interface structures for electronic devicesGEN ELECTRIC·Filed 1999·Granted Jul 25, 2000·97 cites·8 claims
- 3495US5849623AMethod of forming thin film resistors on organic surfacesGEN ELECTRIC·Filed 1997·Granted Dec 15, 1998·183 cites·5 claims
- 3595US5675310AThin film resistors on organic surfacesGEN ELECTRIC·Filed 1994·Granted Oct 7, 1997·165 cites·9 claims
- 3695US5546654AVacuum fixture and method for fabricating electronic assembliesGEN ELECTRIC·Filed 1994·Granted Aug 20, 1996·187 cites·23 claims
- 3795US5452182AFlexible high density interconnect structure and flexibly interconnected systemMARTIN MARIETTA CORP·Filed 1992·Granted Sep 19, 1995·192 cites·17 claims
- 3895US4487811AElectrical conductorGEN ELECTRIC·Filed 1983·Granted Dec 11, 1984·73 cites·27 claims
- 3995US4481404ATurn-off control circuit for self-cleaning ovensGEN ELECTRIC·Filed 1982·Granted Nov 6, 1984·70 cites·20 claims
- 4094US6890234B2LED cross-linkable phosphor coatingGEN ELECTRIC·Filed 2004·Granted May 10, 2005·84 cites·17 claims
- 4194US5857858ADemountable and repairable low pitch interconnect for stacked multichip modulesGEN ELECTRIC·Filed 1996·Granted Jan 12, 1999·170 cites·25 claims
- 4294US5422513AIntegrated circuit chip placement in a high density interconnect structureMARTIN MARIETTA CORP·Filed 1993·Granted Jun 6, 1995·179 cites·8 claims
- 4393US6635987B1High power white LED lamp structure using unique phosphor application for LED lighting productsGEN ELECTRIC·Filed 2000·Granted Oct 21, 2003·190 cites·22 claims
- 4493US6262573B1Electromagnetic system for railroad track crack detection and traction enhancementGEN ELECTRIC·Filed 1999·Granted Jul 17, 2001·91 cites·20 claims
- 4593US5866952AHigh density interconnected circuit module with a compliant layer as part of a stress-reducing molded substrateLOCKHEED CORP·Filed 1995·Granted Feb 2, 1999·239 cites·11 claims
- 4693US5019946AHigh density interconnect with high volumetric efficiencyGEN ELECTRIC·Filed 1988·Granted May 28, 1991·107 cites·22 claims
- 4793US4430557ACooking apparatus having internal pressurizing source and _integral heat source _GEN ELECTRIC·Filed 1982·Granted Feb 7, 1984·68 cites·31 claims
- 4893US4404237AFabrication of electrical conductor by replacement of metallic powder in polymer with more noble metalGEN ELECTRIC·Filed 1980·Granted Sep 13, 1983·67 cites·97 claims
- 4992US6002163AElectronic device pad relocation, precision placement, and packaging in arraysGEN ELECTRIC·Filed 1998·Granted Dec 14, 1999·118 cites·10 claims
- 5092US4884122AMethod and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layerGEN ELECTRIC·Filed 1988·Granted Nov 28, 1989·103 cites·12 claims
Showing the top 50 of 149 patent records by PatentIndex Score.
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