Inventor · disambiguated record
Yurika Araya
Also filed as: ARAYA YURIKA
4 granted patents·14 citations·filing 2016–2017
69Inventor score
Technology areasH10P
Files withDISCO CORP4
Top patents by PatentIndex Score
4 records- 0185US9716040B2Wafer processing method using adhesive tape to pick up device chipsDISCO CORP·Filed 2016·Granted Jul 25, 2017·6 cites·9 claims
- 0281US10269639B2Method of manufacturing packaged waferDISCO CORP·Filed 2017·Granted Apr 23, 2019·4 cites·1 claims
- 0378US9892986B2Packaged wafer manufacturing method and device chip manufacturing methodDISCO CORP·Filed 2017·Granted Feb 13, 2018·3 cites·3 claims
- 0463US10312144B2Method of dividing a wafer by back grindingDISCO CORP·Filed 2017·Granted Jun 4, 2019·1 cites·10 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →