Inventor · disambiguated record
Jong-Heun Lim
Also filed as: LIM JONG HEUN
13 granted patents·8 pending applications·81 citations·filing 2005–2017
90Inventor score
Top patents by PatentIndex Score
21 records- 0194US9997534B2Vertical memory devicesSON YONG HOON·Filed 2016·Granted Jun 12, 2018·14 cites·19 claims
- 0292US9893077B2Memory device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Feb 13, 2018·9 cites·12 claims
- 0390US8664101B2Multiple mold structure methods of manufacturing vertical memory devicesKIM HYO-JUNG·Filed 2012·Granted Mar 4, 2014·17 cites·20 claims
- 0483US8822287B2Methods of manufacturing semiconductor devicesKIM HYO-JUNG·Filed 2011·Granted Sep 2, 2014·7 cites·10 claims
- 0581US8038508B2Apparatus for polishing a wafer and method for detecting a polishing end point by the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Oct 18, 2011·7 cites·17 claims
- 0681US7678625B2Methods of fabricating semiconductor devices including channel layers having improved defect density and surface roughness characteristicsSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Mar 16, 2010·8 cites·19 claims
- 0779US9502332B2Nonvolatile memory device and a method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 22, 2016·5 cites·8 claims
- 0878US8912592B2Non-volatile memory device including etch stop layer patternLIM JONG-HEUN·Filed 2012·Granted Dec 16, 2014·9 cites·20 claims
- 0969US8008172B2Methods of forming semiconductor devices including multistage planarization and crystalization of a semiconductor layerSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Aug 30, 2011·3 cites·14 claims
- 1066US8283248B2Methods of manufacturing semiconductor devicesKIM TAE-HYUN·Filed 2011·Granted Oct 9, 2012·2 cites·20 claims
- 1161US10195715B2Chemical mechanical polishing machine and polishing head assemblySAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Feb 5, 2019·0 cites·19 claims
- 1257US9254546B2Chemical mechanical polishing machine and polishing head assemblySAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Feb 9, 2016·0 cites·20 claims
- 1348US7932163B2Methods of forming stacked semiconductor devices with single-crystal semiconductor regionsSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Apr 26, 2011·0 cites·17 claims
- 1445US2008124930A1Methods of recycling a substrate including using a chemical mechanical polishing processSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1544US2015200259A1Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 1643US2008138960A1Method of manufacturing a stack-type semiconductor deviceHAN SANG-YEOB·Filed 2007·Application pending·0 cites
- 1742US2008164503A1Ferroelectric Memory Devices Having a Protruding Bottom Electrode and Methods of Forming the SameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 1838US2018114706A1Wafer boat assembly and substrate processing apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Application pending·0 cites
- 1937US2006124594A1Chemical mechanical polishing (CMP) slurries and CMP methods using and making the sameLIM JONG-HEUN·Filed 2005·Application pending·0 cites
- 2035US2008247219A1Resistive Random Access Memory Devices Including Sidewall Resistive Layers and Related MethodsSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2133US2012108048A1Three-dimensional semiconductor devices and methods of fabricating the sameLIM JONG HEUN·Filed 2011·Application pending·0 cites
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