Inventor · disambiguated record
Yasuki Fukui
Also filed as: FUKUI YASUKI
10 granted patents·7 pending applications·708 citations·filing 1998–2020
92Inventor score
Top patents by PatentIndex Score
17 records- 0197US6100594ASemiconductor device and method of manufacturing the sameSHARP KK·Filed 1998·Granted Aug 8, 2000·290 cites·29 claims
- 0294US6229217B1Semiconductor device and method of manufacturing the sameSHARP KK·Filed 2000·Granted May 8, 2001·89 cites·33 claims
- 0392US6657290B2Semiconductor device having insulation layer and adhesion layer between chip laminationSHARP KK·Filed 2002·Granted Dec 2, 2003·86 cites·14 claims
- 0492US6352879B1Semiconductor device and method of manufacturing the sameSHARP KK·Filed 2000·Granted Mar 5, 2002·62 cites·15 claims
- 0589US6731013B2Wiring substrate, semiconductor device and package stack semiconductor deviceSHARP KK·Filed 2001·Granted May 4, 2004·68 cites·25 claims
- 0685US6198165B1Semiconductor deviceSHARP KK·Filed 1999·Granted Mar 6, 2001·92 cites·10 claims
- 0776US11467185B2Test socket and method of manufacturing the sameSHARP KK·Filed 2020·Granted Oct 11, 2022·1 cites·10 claims
- 0865US7119426B2Semiconductor device and manufacturing method of sameSHARP KK·Filed 2003·Granted Oct 10, 2006·13 cites·7 claims
- 0958USRE38806ESemiconductor device and method of manufacturing the sameSHARP KK·Filed 2003·Granted Oct 4, 2005·6 cites·33 claims
- 1053US8608388B2Semiconductor device and connectorFUKUI YASUKI·Filed 2010·Granted Dec 17, 2013·1 cites·7 claims
- 1151US2009220783A1Adhesive Sheet for Dicing and Die BondingSHARP KK·Filed 2009·Application pending·0 cites
- 1247US2006197211A1Semiconductor device and method of stacking semiconductor chipsSHARP KK·Filed 2006·Application pending·0 cites
- 1345US2008241995A1Adhesive Sheet For Both Dicing And Die Bonding And Semiconductor Device Manufacturing Method Using The Adhesive SheetSHARP KK·Filed 2005·Application pending·0 cites
- 1445US2008237898A1Semiconductor device, method for manufacturing the same, heat sink, semiconductor chip, interposer substrate, and glass plateYANO YUJI·Filed 2008·Application pending·0 cites
- 1543US2007262466A1Semiconductor deviceSHARP KK·Filed 2007·Application pending·0 cites
- 1639US2002180025A1Semiconductor device and method of stacking semiconductor chipsFiled 2002·Application pending·0 cites
- 1737US2015200176A1Semiconductor device and method for producing sameSHARP KK·Filed 2013·Application pending·0 cites
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