Inventor · disambiguated record
Mehdi Saeidi
Also filed as: SAEIDI MEHDI
25 granted patents·11 pending applications·103 citations·filing 2013–2021
94Inventor score
Top patents by PatentIndex Score
36 records- 0197US9472485B2Hybrid thermal interface material for IC packages with integrated heat spreaderBROADCOM CORP·Filed 2015·Granted Oct 18, 2016·20 cites·20 claims
- 0296US9746889B2Package-on-package (PoP) device comprising bi-directional thermal electric coolerQUALCOMM INC·Filed 2015·Granted Aug 29, 2017·18 cites·34 claims
- 0390US10358230B2Thermal arm for droneQUALCOMM INC·Filed 2016·Granted Jul 23, 2019·10 cites·14 claims
- 0490US10061331B2Systems and methods for detecting thermal runawayQUALCOMM INC·Filed 2015·Granted Aug 28, 2018·5 cites·20 claims
- 0588US9983557B2Adaptive thermal control and power budgetQUALCOMM INC·Filed 2015·Granted May 29, 2018·6 cites·30 claims
- 0688US9652005B2Thermal solution for wearable devices by using wrist band as heat sinkQUALCOMM INC·Filed 2015·Granted May 16, 2017·7 cites·23 claims
- 0786US10401235B2Thermal sensor placement for hotspot interpolationQUALCOMM INC·Filed 2015·Granted Sep 3, 2019·5 cites·19 claims
- 0884US10224264B1High performance evaporation-condensation thermal spreading chamber for compute packagesQUALCOMM INC·Filed 2017·Granted Mar 5, 2019·6 cites·25 claims
- 0984US9629233B2Techniques for implementing a synthetic jet to cool a deviceQUALCOMM INC·Filed 2015·Granted Apr 18, 2017·4 cites·27 claims
- 1083US9829941B1Mobile device with backside capacitive sensor for thermal management of an exterior housingQUALCOMM INC·Filed 2016·Granted Nov 28, 2017·6 cites·26 claims
- 1180US10007310B2Circuits and methods providing calibration for temperature mitigation in a computing deviceQUALCOMM INC·Filed 2016·Granted Jun 26, 2018·3 cites·26 claims
- 1275US10649503B2Device comprising compressed thermal interface material (TIM) and electromagnetic (EMI) shield comprising flexible portionQUALCOMM INC·Filed 2017·Granted May 12, 2020·2 cites·21 claims
- 1375US9625963B2Thermally-constrained voltage and frequency scalingQUALCOMM INC·Filed 2015·Granted Apr 18, 2017·2 cites·16 claims
- 1473US10393594B2Thermopile meshQUALCOMM INC·Filed 2017·Granted Aug 27, 2019·1 cites·28 claims
- 1569US11399720B2Circuits and methods providing temperature mitigation for computing devicesQUALCOMM INC·Filed 2017·Granted Aug 2, 2022·1 cites·21 claims
- 1669US10188015B2Hybrid design of heat spreader and temperature sensor for direct handheld device skin temperature measurementQUALCOMM INC·Filed 2016·Granted Jan 22, 2019·1 cites·25 claims
- 1766US10591965B2System and method for context-aware thermal management and workload scheduling in a portable computing deviceQUALCOMM INC·Filed 2017·Granted Mar 17, 2020·1 cites·30 claims
- 1866US10503222B2Circuits and methods providing temperature mitigation for computing devices using estimated skin temperatureQUALCOMM INC·Filed 2015·Granted Dec 10, 2019·1 cites·25 claims
- 1966US9930769B2Thermal metal ground for integrated circuit resistorsQUALCOMM INC·Filed 2014·Granted Mar 27, 2018·2 cites·17 claims
- 2064US9557797B2Algorithm for preferred core sequencing to maximize performance and reduce chip temperature and powerQUALCOMM INC·Filed 2014·Granted Jan 31, 2017·1 cites·29 claims
- 2162US9971368B2Accurate hotspot detection through temperature sensorsQUALCOMM INC·Filed 2015·Granted May 15, 2018·1 cites·24 claims
- 2250US10141297B1Integrated device comprising device level cells with variable sizes for heat dissipation around hotspotsQUALCOMM INC·Filed 2017·Granted Nov 27, 2018·0 cites·34 claims
- 2348US12306396B2Electronic device comprising an electrowetting deviceQUALCOMM INC·Filed 2021·Granted May 20, 2025·0 cites·36 claims
- 2447US2016092616A1Thermal simulations using convolution and iterative methodsQUALCOMM INC·Filed 2014·Application pending·0 cites
- 2545US2015103866A1DIGITAL TEMPERATURE ESTIMATORS (DTEs) DISPOSED IN INTEGRATED CIRCUITS (ICs) FOR ESTIMATING TEMPERATURE WITHIN THE ICs, AND RELATED SYSTEMS AND METHODSQUALCOMM INC·Filed 2013·Application pending·0 cites
- 2645US2015318230A1Flexural plate wave device for chip coolingBROADCOM CORP·Filed 2015·Application pending·0 cites
- 2740US2018143853A1Circuits and Methods Providing Core Scheduling in Response to Aging for a Multi-Core ProcessorQUALCOMM INC·Filed 2017·Application pending·0 cites
- 2839US9943008B2Thermal modulation of an electronic deviceQUALCOMM INC·Filed 2016·Granted Apr 10, 2018·0 cites·24 claims
- 2939US2018143862A1Circuits and Methods Providing Thread Assignment for a Multi-Core ProcessorQUALCOMM INC·Filed 2016·Application pending·0 cites
- 3038US10159165B2Evaporative cooling solution for handheld electronic devicesQUALCOMM INC·Filed 2017·Granted Dec 18, 2018·0 cites·29 claims
- 3138US2018073933A1Dynamic and fast local hotspot search and real time temperature monitoringQUALCOMM INC·Filed 2016·Application pending·0 cites
- 3237US2017075397A1Circuits and methods providing temperature mitigation for computing devicesQUALCOMM INC·Filed 2015·Application pending·0 cites
- 3337US2017060177A1Thermal management of electronic headsetsQUALCOMM INC·Filed 2015·Application pending·0 cites
- 3436US2017083063A1Circuits and methods providing temperature mitigation for computing devices using in-package sensorQUALCOMM INC·Filed 2015·Application pending·0 cites
- 3534US2017163302A1Heat transfer electromagnetic interference shieldQUALCOMM INC·Filed 2015·Application pending·0 cites
- 3634US2017092558A1Enhancement of chip thermal performance through silicon thermal conductivity modulationQUALCOMM INC·Filed 2015·Application pending·0 cites
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