Inventor · disambiguated record
Frederick Dean Wilmot
Also filed as: WILMOT FREDERICK · WILMOT FREDERICK D · WILMOT FREDERICK DEAN
17 granted patents·5 pending applications·100 citations·filing 2008–2022
92Inventor score
Top patents by PatentIndex Score
22 records- 0195US9228270B2Lipseals and contact elements for semiconductor electroplating apparatusesFENG JINGBIN·Filed 2012·Granted Jan 5, 2016·16 cites·10 claims
- 0294US10435807B2Lipseals and contact elements for semiconductor electroplating apparatusesNOVELLUS SYSTEMS INC·Filed 2015·Granted Oct 8, 2019·5 cites·7 claims
- 0394US7727863B1Sonic irradiation during wafer immersionNOVELLUS SYSTEMS INC·Filed 2008·Granted Jun 1, 2010·33 cites·25 claims
- 0490US9587322B2Wetting wave front control for reduced air entrapment during wafer entry into electroplating bathNOVELLUS SYSTEMS INC·Filed 2015·Granted Mar 7, 2017·6 cites·16 claims
- 0590US9045840B2Dynamic current distribution control apparatus and method for wafer electroplatingPORTER DAVID W·Filed 2011·Granted Jun 2, 2015·7 cites·38 claims
- 0689US9028666B2Wetting wave front control for reduced air entrapment during wafer entry into electroplating bathRANJAN MANISH·Filed 2012·Granted May 12, 2015·14 cites·28 claims
- 0788US10023970B2Dynamic current distribution control apparatus and method for wafer electroplatingNOVELLUS SYSTEMS INC·Filed 2017·Granted Jul 17, 2018·4 cites·17 claims
- 0884US9028657B2Front referenced anodeFENG JINGBIN·Filed 2010·Granted May 12, 2015·5 cites·13 claims
- 0981US9822461B2Dynamic current distribution control apparatus and method for wafer electroplatingNOVELLUS SYSTEMS INC·Filed 2012·Granted Nov 21, 2017·4 cites·30 claims
- 1080US9340893B2Front referenced anodeNOVELLUS SYSTEMS INC·Filed 2015·Granted May 17, 2016·2 cites·14 claims
- 1178US9816196B2Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyteNOVELLUS SYSTEMS INC·Filed 2013·Granted Nov 14, 2017·1 cites·19 claims
- 1272US10968531B2Wetting wave front control for reduced air entrapment during wafer entry into electroplating bathNOVELLUS SYSTEMS INC·Filed 2017·Granted Apr 6, 2021·1 cites·17 claims
- 1372US9512538B2Plating cup with contoured cup bottomHE ZHIAN·Filed 2012·Granted Dec 6, 2016·1 cites·16 claims
- 1471US10351968B2Front referenced anodeNOVELLUS SYSTEMS INC·Filed 2016·Granted Jul 16, 2019·1 cites·24 claims
- 1563US2018030611A1Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyteNOVELLUS SYSTEMS INC·Filed 2017·Application pending·0 cites
- 1662US10053792B2Plating cup with contoured cup bottomNOVELLUS SYSTEMS INC·Filed 2016·Granted Aug 21, 2018·0 cites·6 claims
- 1758US12281402B2Low angle membrane frame for an electroplating cellLAM RES CORP·Filed 2020·Granted Apr 22, 2025·0 cites·20 claims
- 1858US2024076795A1Spatially and dimensionally non-uniform channelled plate for tailored hydrodynamics during electroplatingLAM RES CORP·Filed 2022·Application pending·0 cites
- 1957US2024200223A1Control of dissolved gas concentration in electroplating bathsLAM RES CORP·Filed 2022·Application pending·0 cites
- 2055US2023175161A1Blended contact fingers for preventing cracks during thin substrate handlingLAM RES CORP·Filed 2021·Application pending·0 cites
- 2153US10760178B2Method and apparatus for synchronized pressure regulation of separated anode chamberLAM RES CORP·Filed 2018·Granted Sep 1, 2020·0 cites·20 claims
- 2242US2009211900A1Convenient Replacement of Anode in Semiconductor Electroplating ApparatusNOVELLUS SYSTEMS INC·Filed 2008·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →