Inventor · disambiguated record
Jhih Kuei Ge
Also filed as: GE JHIH-KUEI
6 granted patents·8 pending applications·5 citations·filing 2013–2023
70Inventor score
Top patents by PatentIndex Score
14 records- 0194US12110435B2Etching composition and method for selectively removing silicon nitride during manufacture of a semiconductor deviceVERSUM MAT US LLC·Filed 2022·Granted Oct 8, 2024·3 cites·18 claims
- 0269US11499236B2Etching solution for tungsten word line recessVERSUM MAT US LLC·Filed 2019·Granted Nov 15, 2022·1 cites·23 claims
- 0366US11175587B2Stripper solutions and methods of using stripper solutionsVERSUM MAT US LLC·Filed 2018·Granted Nov 16, 2021·1 cites·20 claims
- 0459US12281251B2Etching composition and method for selectively removing silicon nitride during manufacture of a semiconductor deviceVERSUM MAT US LLC·Filed 2020·Granted Apr 22, 2025·0 cites·23 claims
- 0555US2025304856A1Formulated Alkaline Chemistry For Polysilicon ExhumeVERSUM MAT US LLC·Filed 2023·Application pending·0 cites
- 0653US11955341B2Etching solution and method for selectively removing silicon nitride during manufacture of a semiconductor deviceVERSUM MAT US LLC·Filed 2020·Granted Apr 9, 2024·0 cites·17 claims
- 0753US2024392194A1Post-Dry Etching Photoresist And Metal Containing Residue Removal FormulationVERSUM MAT US LLC·Filed 2022·Application pending·0 cites
- 0852US2015136170A1Method for removing adhesive agentHON HAI PREC IND CO LTD·Filed 2014·Application pending·0 cites
- 0950US2014144590A1Adhesive structure, surface treating agent, and method of separating the sameHON HAI PREC IND CO LTD·Filed 2013·Application pending·0 cites
- 1048US10954480B2Compositions and methods for preventing collapse of high aspect ratio structures during dryingVERSUM MAT US LLC·Filed 2018·Granted Mar 23, 2021·0 cites·24 claims
- 1148US2015183172A1Method for repairing electronic deviceHON HAI PREC IND CO LTD·Filed 2014·Application pending·0 cites
- 1244US2024010915A1Etching Solution For Titanium Nitride And Molybdenum Conductive Metal LinesVERSUM MAT US LLC·Filed 2021·Application pending·0 cites
- 1340US2016347977A1Curing agent, method for making the same, and structural adhesive using the sameHON HAI PREC IND CO LTD·Filed 2015·Application pending·0 cites
- 1435US2019103282A1Etching Solution for Simultaneously Removing Silicon and Silicon-Germanium Alloy From a Silicon-Germanium/Silicon Stack During Manufacture of a Semiconductor DeviceVERSUM MAT US LLC·Filed 2018·Application pending·0 cites
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