Inventor · disambiguated record
Shih-Hsi Tai
Also filed as: TAI SHIH-HSI
3 granted patents·3 pending applications·0 citations·filing 2021–2021
40Inventor score
Files withAMULAIRE THERMAL TECH INC6
Top patents by PatentIndex Score
6 records- 0155US11388811B1Heat-dissipating substrate structure with built-in conductive circuitsAMULAIRE THERMAL TECH INC·Filed 2021·Granted Jul 12, 2022·0 cites·12 claims
- 0250US11895778B2Etching method for manufacturing substrate structure having thick electrically conductive layer, and substrate structure having thick electrically conductive layerAMULAIRE THERMAL TECH INC·Filed 2021·Granted Feb 6, 2024·0 cites·10 claims
- 0350US11469154B2IGBT module with heat dissipation structure having specific layer thickness ratioAMULAIRE THERMAL TECH INC·Filed 2021·Granted Oct 11, 2022·0 cites·7 claims
- 0444US2022399244A1Thermally conductive and electrically insulating substrateAMULAIRE THERMAL TECH INC·Filed 2021·Application pending·0 cites
- 0542US2022418079A1Insulating metal substrate structureAMULAIRE THERMAL TECH INC·Filed 2021·Application pending·0 cites
- 0639US2023199968A1Method for forming pattern on substrate structure without using mask layer and substrate structureAMULAIRE THERMAL TECH INC·Filed 2021·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →