Inventor · disambiguated record
Charles F. Musante
Also filed as: MUSANTE CHARLES F · MUSANTE CHARLES FRANCIS
33 granted patents·6 pending applications·142 citations·filing 2005–2019
96Inventor score
Top patents by PatentIndex Score
39 records- 0197US7759755B2Anti-reflection structures for CMOS image sensorsIBM·Filed 2008·Granted Jul 20, 2010·45 cites·16 claims
- 0292US8003425B2Methods for forming anti-reflection structures for CMOS image sensorsIBM·Filed 2008·Granted Aug 23, 2011·20 cites·12 claims
- 0391US8138534B2Anti-reflection structures for CMOS image sensorsADKISSON JAMES W·Filed 2010·Granted Mar 20, 2012·9 cites·24 claims
- 0490US10090180B2Package assembly for thin wafer shipping and method of useIBM·Filed 2016·Granted Oct 2, 2018·5 cites·12 claims
- 0588US9543175B2Package assembly for thin wafer shipping and method of useIBM·Filed 2013·Granted Jan 10, 2017·6 cites·18 claims
- 0688US8298853B2CMOS pixel sensor cells with poly spacer transfer gates and methods of manufactureADKISSON JAMES W·Filed 2010·Granted Oct 30, 2012·6 cites·24 claims
- 0788US7928527B2Delamination and crack resistant image sensor structures and methodsIBM·Filed 2008·Granted Apr 19, 2011·9 cites·16 claims
- 0887US10468280B2Package assembly for thin wafer shipping and method of useIBM·Filed 2018·Granted Nov 5, 2019·3 cites·18 claims
- 0984US8409904B2Methods for forming anti-reflection structures for CMOS image sensorsADKISSON JAMES W·Filed 2011·Granted Apr 2, 2013·6 cites·28 claims
- 1079US8023021B2High efficiency CMOS image sensor pixel employing dynamic voltage supplyIBM·Filed 2009·Granted Sep 20, 2011·7 cites·6 claims
- 1178US8778737B2Flattened substrate surface for substrate bondingCOONEY III EDWARD C·Filed 2011·Granted Jul 15, 2014·4 cites·22 claims
- 1278US8476099B2Methods for improved adhesion of protective layers of imager microlens structures by forming an interfacial regionCOONEY III EDWARD C·Filed 2010·Granted Jul 2, 2013·1 cites·19 claims
- 1377US8409899B2Delamination and crack resistant image sensor structures and methodsGAMBINO JEFFREY P·Filed 2011·Granted Apr 2, 2013·1 cites·11 claims
- 1477US8009216B2Pixel sensor cell with frame storage capabilityIBM·Filed 2008·Granted Aug 30, 2011·5 cites·17 claims
- 1575US8742560B2Anti-reflection structures for CMOS image sensorsIBM·Filed 2013·Granted Jun 3, 2014·2 cites·7 claims
- 1672US8009215B2Pixel sensor cell with frame storage capabilityIBM·Filed 2008·Granted Aug 30, 2011·3 cites·16 claims
- 1772US7655966B2High efficiency CMOS image sensor pixel employing dynamic voltage supplyIBM·Filed 2008·Granted Feb 2, 2010·4 cites·14 claims
- 1871US9165831B2Dice before grind with backside metalIBM·Filed 2013·Granted Oct 20, 2015·2 cites·15 claims
- 1968US8878326B2Imager microlens structure having interfacial region for adhesion of protective layerIBM·Filed 2013·Granted Nov 4, 2014·0 cites·8 claims
- 2067US9953940B2Corrosion resistant aluminum bond pad structureIBM·Filed 2015·Granted Apr 24, 2018·1 cites·14 claims
- 2167US7923750B2Pixel sensor cell, methods and design structure including optically transparent gateIBM·Filed 2008·Granted Apr 12, 2011·1 cites·18 claims
- 2266US10784137B2Package assembly for thin wafer shipping and method of useIBM·Filed 2019·Granted Sep 22, 2020·0 cites·18 claims
- 2364US9716010B2Handle waferIBM·Filed 2013·Granted Jul 25, 2017·1 cites·12 claims
- 2463US10615137B2Corrosion resistant aluminum bond pad structureIBM·Filed 2019·Granted Apr 7, 2020·0 cites·13 claims
- 2562US8912091B2Backside metal ground plane with improved metal adhesion and design structuresIBM·Filed 2013·Granted Dec 16, 2014·1 cites·23 claims
- 2659US10204877B2Corrosion resistant aluminum bond pad structureIBM·Filed 2018·Granted Feb 12, 2019·0 cites·19 claims
- 2758US10622235B2Package assembly for thin wafer shipping and method of useIBM·Filed 2016·Granted Apr 14, 2020·0 cites·14 claims
- 2854US8716771B2Anti-reflection structures for CMOS image sensorsADKISSON JAMES W·Filed 2012·Granted May 6, 2014·0 cites·17 claims
- 2954US8233070B2Variable dynamic range pixel sensor cell, design structure and methodELLIS-MONAGHAN JOHN J·Filed 2009·Granted Jul 31, 2012·0 cites·18 claims
- 3051US10163673B2Dual adhesive bonding with perforated waferGLOBALFOUNDRIES INC·Filed 2013·Granted Dec 25, 2018·0 cites·17 claims
- 3151US2009311822A1Pixel sensor cell, methods and design structure including optically transparent gateIBM·Filed 2008·Application pending·0 cites
- 3249US9312205B2Methods of forming a TSV wafer with improved fracture strengthIBM·Filed 2014·Granted Apr 12, 2016·0 cites·18 claims
- 3347US9059111B2Reliable back-side-metal structureIBM·Filed 2013·Granted Jun 16, 2015·0 cites·10 claims
- 3444US9607929B2Tsv wafer with improved fracture strengthIBM·Filed 2015·Granted Mar 28, 2017·0 cites·16 claims
- 3543US2015044619A1Carrier for Ultra-Thin Substrates and Method of UseIBM·Filed 2013·Application pending·0 cites
- 3642US2014225231A1Modulating bow of thin wafersIBM·Filed 2013·Application pending·0 cites
- 3742US2007158714A1One-mask high-k metal-insulator-metal capacitor integration in copper back-end-of-line processingIBM·Filed 2005·Application pending·0 cites
- 3841US2015076029A1Package assembly for thin wafer shippingIBM·Filed 2013·Application pending·0 cites
- 3941US2014138844A1Patterned backside metal ground plane for improved metal adhesionIBM·Filed 2012·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →