Inventor · disambiguated record
Hideo Yumi
Also filed as: YUMI HIDEO
17 granted patents·3 pending applications·208 citations·filing 1991–2018
93Inventor score
Top patents by PatentIndex Score
20 records- 0192US5142101AElectromagnetic-shielding gasketKITAGAWA IND CO LTD·Filed 1991·Granted Aug 25, 1992·96 cites·20 claims
- 0291US9510452B2Electromagnetic shielding member and electromagnetic shielding structureKITAGAWA IND CO LTD·Filed 2015·Granted Nov 29, 2016·8 cites·13 claims
- 0380US8974165B2ScrewKITAGAWA IND CO LTD·Filed 2013·Granted Mar 10, 2015·9 cites·13 claims
- 0477US9167698B2Surface mount clipKONDA KENJI·Filed 2011·Granted Oct 20, 2015·5 cites·10 claims
- 0576US10014610B2Conductive contact including an elastic contact piece with protruding portionsKITAGAWA IND CO LTD·Filed 2017·Granted Jul 3, 2018·4 cites·8 claims
- 0672US8475180B2Conductive componentYUMI HIDEO·Filed 2010·Granted Jul 2, 2013·4 cites·16 claims
- 0770US9570827B2Contact memberKITAGAWA IND CO LTD·Filed 2015·Granted Feb 14, 2017·3 cites·14 claims
- 0868US7503774B2Surface mount contact memberKITAGAWA IND CO LTD·Filed 2008·Granted Mar 17, 2009·10 cites·3 claims
- 0968US5569877ASewn material and method for shielding against electromagnetic wavesKITAGAWA IND CO LTD·Filed 1995·Granted Oct 29, 1996·29 cites·20 claims
- 1063US6674018B2Grounding terminal and mounting structure of the same on a printed circuit boardKITIGAWA IND CO LTD·Filed 2001·Granted Jan 6, 2004·11 cites·8 claims
- 1160US8569626B2ContactKURITA TOMOHISA·Filed 2010·Granted Oct 29, 2013·5 cites·15 claims
- 1255US6568583B2Conductive element and manufacturing method thereofKITAGAWA IND CO LTD·Filed 2001·Granted May 27, 2003·9 cites·19 claims
- 1354US6300579B1Grounding terminal and mounting structure of the same on a printed circuit boardKITAGAWA IND CO LTD·Filed 1999·Granted Oct 9, 2001·12 cites·14 claims
- 1451US6465738B2Grounding terminal and mounting structure of the same on a printed circuit boardKITIGAWA IND CO LTD·Filed 2001·Granted Oct 15, 2002·3 cites·3 claims
- 1551US2010068901A1Surface mount contactKITAGAWA IND CO LTD·Filed 2009·Application pending·0 cites
- 1650US2019003787A1Thermally conductive liquid packKITAGAWA IND CO LTD·Filed 2018·Application pending·0 cites
- 1750US2014261605A1Thermoelectric conversion moduleNAT INST OF ADVANCED IND SCIEN·Filed 2014·Application pending·0 cites
- 1844US10132575B2Heat conduction member, production method for heat conduction member, and heat conduction structureKITAGAWA IND CO LTD·Filed 2017·Granted Nov 20, 2018·0 cites·10 claims
- 1934US9455389B2Thermoelectric conversion element, manufacturing method for the thermoelectric conversion element, and thermoelectric conversion moduleKAWAGUCHI YASUHIRO·Filed 2012·Granted Sep 27, 2016·0 cites·8 claims
- 2032US8808011B2Contact and bonding structure of the contactKITANO HIROKI·Filed 2011·Granted Aug 19, 2014·0 cites·7 claims
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