Inventor · disambiguated record
Robert Schetty
Also filed as: SCHETTY III ROBERT A · SCHETTY ROBERT A · SCHETTY ROBERT A III
7 granted patents·12 pending applications·220 citations·filing 1988–2008
88Inventor score
Top patents by PatentIndex Score
19 records- 0193US6444110B2Electrolytic copper plating methodSHIPLEY CO LLC·Filed 1999·Granted Sep 3, 2002·86 cites·46 claims
- 0286US6860981B2Minimizing whisker growth in tin electrodepositsTECHNIC·Filed 2002·Granted Mar 1, 2005·34 cites·30 claims
- 0385US6531046B2Seed layer repair methodSHIPLEY CO LLC·Filed 2000·Granted Mar 11, 2003·44 cites·20 claims
- 0473US7270734B1Near neutral pH cleaning/activation process to reduce surface oxides on metal surfaces prior to electroplatingTECHNIC·Filed 2004·Granted Sep 18, 2007·13 cites·16 claims
- 0573US4994155AHigh speed tin, lead or tin/lead alloy electroplatingLEARONAL INC·Filed 1989·Granted Feb 19, 1991·21 cites·18 claims
- 0672US4880507ATin, lead or tin/lead alloy electrolytes for high speed electroplatingLEARONAL INC·Filed 1988·Granted Nov 14, 1989·19 cites·31 claims
- 0759US2006065538A1Alloy composition and plating methodSHIPLEY CO LLC·Filed 2005·Application pending·0 cites
- 0858US6982030B2Reduction of surface oxidation during electroplatingTECHNIC·Filed 2002·Granted Jan 3, 2006·3 cites·16 claims
- 0953US2006016692A1Reduction of surface oxidation during electroplatingTECHNIC·Filed 2005·Application pending·0 cites
- 1050US2009120497A1Method of metallizing solar cell conductors by electroplating with minimal attack on underlying materials of constructionSCHETTY III ROBERT A·Filed 2008·Application pending·0 cites
- 1149US2006065537A1Electrolytic copper plating solutionsBARSTAD LEON R·Filed 2005·Application pending·0 cites
- 1245US2005145502A1Minimizing whisker growth in tin electrodepositsFiled 2004·Application pending·0 cites
- 1345US2006113195A1Near neutral pH tin electroplating solutionHRADIL GEORGE·Filed 2005·Application pending·0 cites
- 1440US2006183328A1Electrolytic copper plating solutionsBARSTAD LEON R·Filed 2005·Application pending·0 cites
- 1540US2006292847A1Silver barrier layers to minimize whisker growth in tin electrodepositsSCHETTY ROBERT A III·Filed 2006·Application pending·0 cites
- 1640US2007007144A1Tin electrodeposits having properties or characteristics that minimize tin whisker growthSCHETTY ROBERT A III·Filed 2006·Application pending·0 cites
- 1740US2003010646A1Electrolytic copper plating solutionsFiled 2002·Application pending·0 cites
- 1839US2002166774A1Alloy composition and plating methodSHIPLEY CO LLC·Filed 2001·Application pending·0 cites
- 1936US2006240276A1Underlayer for reducing surface oxidation of plated depositsTECHNIC·Filed 2006·Application pending·0 cites
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