Inventor · disambiguated record
Kathleen A. Stalter
Also filed as: STALTER KATHLEEN A · STALTER KATHLEEN ANN
23 granted patents·986 citations·filing 1997–2003
97Inventor score
Files withIBM23
Top patents by PatentIndex Score
23 records- 0199US6258625B1Method of interconnecting electronic components using a plurality of conductive studsIBM·Filed 1999·Granted Jul 10, 2001·243 cites·14 claims
- 0295US6270363B1Z-axis compressible polymer with fine metal matrix suspensionIBM·Filed 1999·Granted Aug 7, 2001·105 cites·24 claims
- 0393US6283359B1Method for enhancing fatigue life of ball grid arraysIBM·Filed 2000·Granted Sep 4, 2001·53 cites·5 claims
- 0488US6184062B1Process for forming cone shaped solder for chip interconnectionIBM·Filed 1999·Granted Feb 6, 2001·56 cites·71 claims
- 0587US6300164B1Structure, materials, and methods for socketable ball gridIBM·Filed 2000·Granted Oct 9, 2001·42 cites·16 claims
- 0685US6559527B2Process for forming cone shaped solder for chip interconnectionIBM·Filed 2001·Granted May 6, 2003·28 cites·20 claims
- 0784US6297559B1Structure, materials, and applications of ball grid array interconnectionsIBM·Filed 1998·Granted Oct 2, 2001·55 cites·42 claims
- 0882US6158644AMethod for enhancing fatigue life of ball grid arraysIBM·Filed 1998·Granted Dec 12, 2000·43 cites·9 claims
- 0981US5968670AEnhanced ceramic ball grid array using in-situ solder stretch with springIBM·Filed 1997·Granted Oct 19, 1999·63 cites·17 claims
- 1074US6278184B1Solder disc connectionIBM·Filed 1999·Granted Aug 21, 2001·35 cites·14 claims
- 1174US5964396AEnhanced ceramic ball grid array using in-situ solder stretch with clipIBM·Filed 1997·Granted Oct 12, 1999·36 cites·15 claims
- 1269US6220499B1Method for assembling a chip carrier to a semiconductor deviceIBM·Filed 1998·Granted Apr 24, 2001·30 cites·7 claims
- 1368US6548909B2Method of interconnecting electronic components using a plurality of conductive studsIBM·Filed 2001·Granted Apr 15, 2003·11 cites·12 claims
- 1468US6216937B1Process and apparatus to remove closely spaced chips on a multi-chip moduleIBM·Filed 1999·Granted Apr 17, 2001·31 cites·12 claims
- 1568US5975409ACeramic ball grid array using in-situ solder stretchIBM·Filed 1997·Granted Nov 2, 1999·36 cites·5 claims
- 1667US6360938B2Process and apparatus to remove closely spaced chips on a multi-chip moduleIBM·Filed 2001·Granted Mar 26, 2002·12 cites·12 claims
- 1767US6253986B1Solder disc connectionIBM·Filed 1999·Granted Jul 3, 2001·25 cites·5 claims
- 1866US6984792B2Dielectric interposer for chip to substrate solderingIBM·Filed 2003·Granted Jan 10, 2006·9 cites·14 claims
- 1964US6120885AStructure, materials, and methods for socketable ball gridIBM·Filed 1998·Granted Sep 19, 2000·25 cites·18 claims
- 2060US6070321ASolder disc connectionIBM·Filed 1997·Granted Jun 6, 2000·20 cites·12 claims
- 2156US6218629B1Module with metal-ion matrix induced dendrites for interconnectionIBM·Filed 1999·Granted Apr 17, 2001·18 cites·11 claims
- 2249US6584684B2Method for assembling a carrier and a semiconductor deviceIBM·Filed 2001·Granted Jul 1, 2003·3 cites·16 claims
- 2339US6657313B1Dielectric interposer for chip to substrate solderingIBM·Filed 1999·Granted Dec 2, 2003·7 cites·12 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →