Inventor · disambiguated record
Qingchun He
Also filed as: HE QINGCHUN
18 granted patents·22 pending applications·33 citations·filing 2009–2024
90Inventor score
Top patents by PatentIndex Score
40 records- 0192US9177836B1Packaged integrated circuit device having bent leadsLIU PENG·Filed 2014·Granted Nov 3, 2015·16 cites·7 claims
- 0291US11206106B2Data packet synchronizationZTE CORP·Filed 2020·Granted Dec 21, 2021·3 cites·18 claims
- 0380US11019680B2Entity configuration method, device and system, and CU-UZTE CORP·Filed 2019·Granted May 25, 2021·2 cites·14 claims
- 0476US10980043B2Data transmission method and device, and base stationZTE CORP·Filed 2017·Granted Apr 13, 2021·2 cites·12 claims
- 0571US11153783B2Flow control method and apparatus, CU, DU and storage mediumZTE CORP·Filed 2019·Granted Oct 19, 2021·1 cites·12 claims
- 0671US8643158B2Semiconductor package and lead frame thereforLIU PENG·Filed 2012·Granted Feb 4, 2014·3 cites·9 claims
- 0769US11765787B2Entity configuration method, device and system, and CU-UZTE CORP·Filed 2021·Granted Sep 19, 2023·0 cites·14 claims
- 0869US8642395B2Method of making chip-on-lead packageLI ZHE·Filed 2010·Granted Feb 4, 2014·3 cites·8 claims
- 0966US11606720B2Flow control method and apparatus, CU, DU and storage mediumZTE CORP·Filed 2021·Granted Mar 14, 2023·0 cites·16 claims
- 1063US2024267963A1Communication method and apparatusHUAWEI TECH CO LTD·Filed 2024·Application pending·0 cites
- 1162US2024236827A1Service access method and communication apparatusHUAWEI TECH CO LTD·Filed 2024·Application pending·0 cites
- 1262US2024244681A1Communication method, apparatus, and systemHUAWEI TECH CO LTD·Filed 2024·Application pending·0 cites
- 1362US2024205674A1Communication method, apparatus, and systemHUAWEI TECH CO LTD·Filed 2024·Application pending·0 cites
- 1462US2024155310A1Broadcast information processing method and apparatusHUAWEI TECH CO LTD·Filed 2024·Application pending·0 cites
- 1562US2024236839A1Communication method and communication apparatusHUAWEI TECH CO LTD·Filed 2024·Application pending·0 cites
- 1662US2024244465A1Communication method and related deviceHUAWEI TECH CO LTD·Filed 2024·Application pending·0 cites
- 1762US2024214874A1Communication method, apparatus, and systemHUAWEI TECH CO LTD·Filed 2024·Application pending·0 cites
- 1860US10560226B2Data packet synchronizationZTE CORP·Filed 2019·Granted Feb 11, 2020·0 cites·15 claims
- 1960US9355944B1Semiconductor device and lead frame having vertical connection barsLIU PENG·Filed 2015·Granted May 31, 2016·1 cites·11 claims
- 2059US8080448B1Semiconductor device with nested rows of contactsWU PING·Filed 2011·Granted Dec 20, 2011·1 cites·14 claims
- 2156US8969135B2Semiconductor device and method of assembling sameLIU PENG·Filed 2013·Granted Mar 3, 2015·1 cites·13 claims
- 2256US2024251300A1Communication method, apparatus, and systemHUAWEI TECH CO LTD·Filed 2024·Application pending·0 cites
- 2356US2024267433A1Communication method, apparatus, and systemHUAWEI TECH CO LTD·Filed 2024·Application pending·0 cites
- 2455US12127160B2Communication method and apparatusHUAWEI TECH CO LTD·Filed 2021·Granted Oct 22, 2024·0 cites·20 claims
- 2555US2024163906A1Communication method and apparatusHUAWEI TECH CO LTD·Filed 2024·Application pending·0 cites
- 2655US2024163023A1Data transmission method, apparatus, and systemHUAWEI TECH CO LTD·Filed 2024·Application pending·0 cites
- 2755US2024195551A1Communication method and apparatusHUAWEI TECH CO LTD·Filed 2024·Application pending·0 cites
- 2847US2011065240A1Lead frame and method of forming sameFREESCALE SEMICONDUCTOR INC·Filed 2009·Application pending·0 cites
- 2942US9328425B2Device and process for continuously cleaning surface of molybdenum wire at high temperatureHE QINGCHUN·Filed 2011·Granted May 3, 2016·0 cites·17 claims
- 3040US2019356450A1Control signaling configuration method and apparatusZTE CORP·Filed 2017·Application pending·0 cites
- 3140US2020015312A1Method and device for determining discontinuous reception configurationZTE CORP·Filed 2017·Application pending·0 cites
- 3239US8692134B2Brace for long wire bondYANG JIE·Filed 2011·Granted Apr 8, 2014·0 cites·6 claims
- 3339US2015235969A1Backside metallization patterns for integrated circuitsZHANG HANMIN·Filed 2014·Application pending·0 cites
- 3439US2012112333A1Semiconductor device with nested rows of contactsLIU QIANG·Filed 2011·Application pending·0 cites
- 3538US8486540B2Lead frame sheetLI TING·Filed 2011·Granted Jul 16, 2013·0 cites·15 claims
- 3638US2011241187A1Lead frame with recessed die bond areaFREESCALE SEMICONDUCTOR INC·Filed 2011·Application pending·0 cites
- 3737US9570325B2Packaged semiconductor devices having ribbon wiresFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Feb 14, 2017·0 cites·10 claims
- 3837US2011193207A1Lead frame for semiconductor dieFREESCALE SEMICONDUCTOR INC·Filed 2011·Application pending·0 cites
- 3933US2011165729A1Method of packaging semiconductor deviceFREESCALE SEMICONDUCTOR INC·Filed 2010·Application pending·0 cites
- 4032US2014103096A1Wire bonding machine and method for testing wire bond connectionsZHANG HANMIN·Filed 2013·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →