Inventor · disambiguated record
Ryuji Nomoto
Also filed as: NOMOTO RYUJI
20 granted patents·3 pending applications·1,946 citations·filing 1996–2013
97Inventor score
Top patents by PatentIndex Score
23 records- 0199US6072239ADevice having resin package with projectionsFUJITSU LTD·Filed 1996·Granted Jun 6, 2000·241 cites·14 claims
- 0298US6476503B1Semiconductor device having columnar electrode and method of manufacturing sameFUJITSU LTD·Filed 2000·Granted Nov 5, 2002·266 cites·11 claims
- 0398US5656550AMethod of producing a semicondutor device having a lead portion with outer connecting terminalFUJITSU LTD·Filed 1996·Granted Aug 12, 1997·366 cites·24 claims
- 0496US7456089B2Semiconductor device and method of manufacturing the semiconductor deviceFUJITSU LTD·Filed 2006·Granted Nov 25, 2008·53 cites·4 claims
- 0596US6573121B2Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frameFUJITSU LTD·Filed 2001·Granted Jun 3, 2003·126 cites·15 claims
- 0696US6376921B1Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frameFUJITSU LTD·Filed 1998·Granted Apr 23, 2002·120 cites·11 claims
- 0794US6215182B1Semiconductor device and method for producing the sameFUJITSU LTD·Filed 2000·Granted Apr 10, 2001·141 cites·6 claims
- 0893US7122897B2Semiconductor device and method of manufacturing the semiconductor deviceFUJITSU LTD·Filed 2004·Granted Oct 17, 2006·72 cites·10 claims
- 0992US6255740B1Semiconductor device having a lead portion with outer connecting terminalsFUJITSU LTD·Filed 1997·Granted Jul 3, 2001·122 cites·7 claims
- 1089US6329711B1Semiconductor device and mounting structureFUJITSU LTD·Filed 1998·Granted Dec 11, 2001·122 cites·13 claims
- 1187US6288444B1Semiconductor device and method of producing the sameFUJITSU LTD·Filed 1999·Granted Sep 11, 2001·80 cites·24 claims
- 1284US5930603AMethod for producing a semiconductor deviceFUJITSU LTD·Filed 1997·Granted Jul 27, 1999·77 cites·10 claims
- 1381US5842628AWire bonding method, semiconductor device, capillary for wire bonding and ball bump forming methodFUJITSU LTD·Filed 1996·Granted Dec 1, 1998·56 cites·8 claims
- 1478US7863745B2Semiconductor device, manufacturing method of the semiconductor device, and mounting method of the semiconductor deviceFUJITSU SEMICONDUCTOR LTD·Filed 2006·Granted Jan 4, 2011·8 cites·7 claims
- 1574US6495773B1Wire bonded device with ball-shaped bondsFUJITSU LTD·Filed 1998·Granted Dec 17, 2002·38 cites·4 claims
- 1673US6207477B1Semiconductor device having a ball grid array and a fabrication process thereofFUJITSU LTD·Filed 1998·Granted Mar 27, 2001·37 cites·9 claims
- 1761US9041186B2Encapsulated semiconductor chips with wiring including controlling chip and method of making the sameFUJITSU SEMICONDUCTOR LTD·Filed 2013·Granted May 26, 2015·1 cites·19 claims
- 1857US7251801B2Method of designing circuit boardFUJITSU LTD·Filed 2004·Granted Jul 31, 2007·6 cites·7 claims
- 1956US6856017B2Device having resin package and method of producing the sameFUJITSU LTD·Filed 1999·Granted Feb 15, 2005·13 cites·19 claims
- 2047US7144754B2Device having resin package and method of producing the sameFUJITSU LTD·Filed 2004·Granted Dec 5, 2006·1 cites·7 claims
- 2146US2008197466A1Semiconductor device and manufacturing method thereofFUJITSU LTD·Filed 2008·Application pending·0 cites
- 2238US2001052653A1Semiconductor device and method of producing the sameFiled 2001·Application pending·0 cites
- 2338US2001001714A1Semiconductor device having a ball grid array and a fabrication process thereofFUJITSU LTD·Filed 2001·Application pending·0 cites
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