Inventor · disambiguated record
Chin-Hsiung Liao
Also filed as: LIAO CHIN-HSIUNG
3 granted patents·1 pending application·40 citations·filing 2003–2008
71Inventor score
Files withCYNTEC CO LTD3
Top patents by PatentIndex Score
4 records- 0189US7675396B2Inductor and manufacture method thereofCYNTEC CO LTD·Filed 2008·Granted Mar 9, 2010·20 cites·5 claims
- 0260US6775145B1Construction for high density power module package (case II)CYNTEC CO LTD·Filed 2003·Granted Aug 10, 2004·11 cites·12 claims
- 0357US6975513B2Construction for high density power module packageCYNTEC CO LTD·Filed 2003·Granted Dec 13, 2005·9 cites·5 claims
- 0435US2005093121A1Chip package and substrateFiled 2004·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →