Inventor · disambiguated record
Seong-Chan Han
Also filed as: HAN SEONG-CHAN
21 granted patents·15 pending applications·243 citations·filing 1998–2018
94Inventor score
Top patents by PatentIndex Score
36 records- 0193US8385080B2Semiconductor module, socket for the same, and semiconductor module/socket assemblySAMSUNG ELECTRONICS CO LTD·Filed 2011·Granted Feb 26, 2013·16 cites·16 claims
- 0288US6449156B1Heat sink provided with coupling means, memory module attached with the heat sink and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Sep 10, 2002·52 cites·13 claims
- 0385US8587946B2Semiconductor module socket apparatusLEE JOO-HAN·Filed 2011·Granted Nov 19, 2013·13 cites·18 claims
- 0481US7960655B2Printed circuit board, method of manufacturing the printed circuit board, memory module having the printed circuit board and method of manufacturing the memory moduleSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Jun 14, 2011·9 cites·9 claims
- 0581US6062799AApparatus and method for automatically loading or unloading printed circuit boards for semiconductor modulesSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted May 16, 2000·55 cites·16 claims
- 0680US7791178B2Lead frame unit, semiconductor package having a lead frame unit, stacked semiconductor package having a semiconductor package and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Sep 7, 2010·9 cites·20 claims
- 0780US5927504AApparatus for carrying plural printed circuit boards for semiconductor moduleSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Jul 27, 1999·52 cites·10 claims
- 0877US8189342B2Printed circuit board for memory module, method of manufacturing the same and memory module/socket assemblyBANG HYO-JAE·Filed 2006·Granted May 29, 2012·8 cites·10 claims
- 0972US8070048B2Method of attaching a solder ball and method of repairing a memory moduleOH NAM-YONG·Filed 2010·Granted Dec 6, 2011·5 cites·21 claims
- 1070US8218330B2Reworkable passive element embedded printed circuit boardBANG HYO-JAE·Filed 2007·Granted Jul 10, 2012·4 cites·15 claims
- 1168US8616907B2Test socket for testing electrical characteristics of a memory moduleKIM JUNG-HOON·Filed 2011·Granted Dec 31, 2013·6 cites·20 claims
- 1266US7900349B2Method of fabricating an electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Mar 8, 2011·3 cites·17 claims
- 1365US7576437B2Printed circuit board of semiconductor package and method for mounting semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 18, 2009·3 cites·16 claims
- 1464US7663219B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Feb 16, 2010·2 cites·7 claims
- 1563US10734258B2Underfill solution supplying device for a dispenser, dispenser including the same, and method of manufacturing a semiconductor module using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 4, 2020·1 cites·17 claims
- 1663US7902664B2Semiconductor package having passive component and semiconductor memory module including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Mar 8, 2011·3 cites·12 claims
- 1760US7906423B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Mar 15, 2011·1 cites·7 claims
- 1859US2010015362A1Method of electroless platingSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 1958US9922846B2Method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Mar 20, 2018·1 cites·25 claims
- 2050US8148828B2Semiconductor packaging deviceSHIN DONG-WOO·Filed 2009·Granted Apr 3, 2012·0 cites·39 claims
- 2150US2009257209A1Semiconductor package and associated methodsHAN SEONG-CHAN·Filed 2009·Application pending·0 cites
- 2249US2007189451A1Apparatus for inspecting a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 2347US8053889B2Semiconductor moduleSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Nov 8, 2011·0 cites·17 claims
- 2447US2008042279A1Mounting structure of semiconductor device having flux and under fill resin layer and method of mounting semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 2546US2009014503A1Reflow apparatuses and methods for reflowSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2646US2007072467A1Method of testing a substrate and apparatus for performing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 2746US2008164054A1Printed circuit board capable of void control during surface mounting processSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2845US2008136580A1Chip network resistor contacting pcb through solder balls and semiconductor module having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 2943US2006283009A1Component mounting apparatus including a demagnetizing device and method thereofSHIN DONG-WOO·Filed 2006·Application pending·0 cites
- 3042US2008044951A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 3142US2008079128A1Lead frame type stack package and method o fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 3237US2011079872A1Passive device, semiconductor module, electronic circuit board, and electronic system having the passive device, and methods of fabricating and inspecting the semiconductor moduleSAMSUNG ELECTRONICS CO LTD·Filed 2010·Application pending·0 cites
- 3337US2010210042A1Method of manufacturing semiconductor moduleSAMSUNG ELECTRONICS CO LTD·Filed 2010·Application pending·0 cites
- 3437US2011168761A1Apparatus for repairing semiconductor moduleSAMSUNG ELECTRONICS CO LTD·Filed 2011·Application pending·0 cites
- 3533US2012182653A1Semiconductor module and system including the sameLEE JOO-HAN·Filed 2011·Application pending·0 cites
- 3628US9056377B2Router apparatusYUN CHAN-HYUNG·Filed 2011·Granted Jun 16, 2015·0 cites·11 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →