Inventor · disambiguated record
Tzu-Han Lin
Also filed as: LIN TZU-HAN
28 granted patents·11 pending applications·276 citations·filing 2004–2021
96Inventor score
Files withVISERA TECHNOLOGIES CO LTD23TAIWAN SEMICONDUCTOR MFG3TSLC CORP3CHANG KUO-CHING2KUO WU-CHENG2
Top patents by PatentIndex Score
39 records- 0195US7569409B2Isolation structures for CMOS image sensor chip scale packagesVISERA TECHNOLOGIES CO LTD·Filed 2007·Granted Aug 4, 2009·36 cites·14 claims
- 0294US7994531B2White-light light emitting diode chips and fabrication methods thereofVISERA TECHNOLOGIES CO LTD·Filed 2009·Granted Aug 9, 2011·44 cites·17 claims
- 0387US7928655B2Light-emitting diode device and method for fabricating the sameVISERA TECHNOLOGIES CO LTD·Filed 2008·Granted Apr 19, 2011·17 cites·8 claims
- 0487US7433555B2Optoelectronic device chip having a composite spacer structure and method making sameVISERA TECHNOLOGIES CO LTD·Filed 2006·Granted Oct 7, 2008·16 cites·7 claims
- 0586US9484385B2Method for fabricating an image sensor packageVISERA TECHNOLOGIES CO LTD·Filed 2015·Granted Nov 1, 2016·4 cites·20 claims
- 0686US7928458B2Light-emitting diode device and method for fabricating the sameVISERA TECHNOLOGIES CO LTD·Filed 2008·Granted Apr 19, 2011·13 cites·11 claims
- 0786US7528420B2Image sensing devices and methods for fabricating the sameVISERA TECHNOLOGIES CO LTD·Filed 2007·Granted May 5, 2009·31 cites·11 claims
- 0885US7829966B2Electronic assembly for image sensor deviceVISERA TECHNOLOGIES CO LTD·Filed 2007·Granted Nov 9, 2010·8 cites·19 claims
- 0982US7994598B2Electronic assembly for image sensor deviceVISERA TECHNOLOGIES CO LTD·Filed 2010·Granted Aug 9, 2011·4 cites·8 claims
- 1081US7932529B2Light-emitting diode device and method for fabricating the sameVISERA TECHNOLOGIES CO LTD·Filed 2008·Granted Apr 26, 2011·11 cites·11 claims
- 1180US7703997B2Image sensor module having precise image-projection controlVISERA TECHNOLOGIES CO LTD·Filed 2007·Granted Apr 27, 2010·6 cites·26 claims
- 1280US7122458B2Method for fabricating pad redistribution layerTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Oct 17, 2006·35 cites·17 claims
- 1377US9231012B2Image sensor packageWENG JUI-PING·Filed 2007·Granted Jan 5, 2016·6 cites·12 claims
- 1473US7860357B2Optoelectronic device chip having a composite spacer structure and method making sameVISERA TECHNOLOGIES CO LTD·Filed 2008·Granted Dec 28, 2010·5 cites·7 claims
- 1572US10256217B2Light emitting deviceTSLC CORP·Filed 2017·Granted Apr 9, 2019·3 cites·13 claims
- 1671US7679167B2Electronic assembly for image sensor device and fabrication method thereofVISERA TECHNOLOGIES CO LTD·Filed 2007·Granted Mar 16, 2010·5 cites·28 claims
- 1770US7807484B2Light-emitting diode device and method for fabricating the sameVISERA TECHNOLOGIES CO LTD·Filed 2008·Granted Oct 5, 2010·4 cites·22 claims
- 1868US7833810B2Method of fabricating isolation structures for CMOS image sensor chip scale packagesVISERA TECHNOLOGIES CO LTD·Filed 2009·Granted Nov 16, 2010·3 cites·8 claims
- 1967US7732244B2Method for forming light-transmitting regionsVISERA TECHNOLOGIES CO LTD·Filed 2007·Granted Jun 8, 2010·1 cites·20 claims
- 2067US7595220B2Image sensor package and fabrication method thereofVISERA TECHNOLOGIES CO LTD·Filed 2007·Granted Sep 29, 2009·3 cites·9 claims
- 2166US2022131056A1UV LED Package Having Encapsulating Extraction LayerTSLC CORP·Filed 2021·Application pending·0 cites
- 2265US7964936B2Electronic device package with electromagnetic compatibility (EMC) coating thereonVISERA TECHNOLOGIES CO LTD·Filed 2008·Granted Jun 21, 2011·3 cites·26 claims
- 2364US8524521B2Method for making wafer level image moduleLEE HSIAO-WEN·Filed 2009·Granted Sep 3, 2013·1 cites·8 claims
- 2464US7592680B2Wafer level image moduleVISERA TECHNOLOGIES CO LTD·Filed 2006·Granted Sep 22, 2009·1 cites·5 claims
- 2563US7187078B2Bump structureTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Mar 6, 2007·13 cites·21 claims
- 2662US2021111318A1Uv led packageTSLC CORP·Filed 2019·Application pending·0 cites
- 2753US7898070B2Image sensor package and fabrication method thereofVISERA TECHNOLOGIES CO LTD·Filed 2009·Granted Mar 1, 2011·0 cites·10 claims
- 2850US8153458B2Image sensing devices and methods for fabricating the sameWENG JUI-PING·Filed 2009·Granted Apr 10, 2012·3 cites·8 claims
- 2947US8502257B2Light-emitting diode packageCHANG KUO-CHING·Filed 2009·Granted Aug 6, 2013·0 cites·17 claims
- 3046US2010127288A1Light-emitting diode devices and methods for fabricating the sameVISERA TECHNOLOGIES CO LTD·Filed 2008·Application pending·0 cites
- 3143US2010237379A1Light emitting deviceKUO WU-CHENG·Filed 2009·Application pending·0 cites
- 3243US2010237378A1Light emitting diode package structure and fabrication thereofLIN TZU-HAN·Filed 2009·Application pending·0 cites
- 3342US2011037081A1White light-emitting diode packages with tunable color temperatureKUO WU-CHENG·Filed 2009·Application pending·0 cites
- 3441US2010001305A1Semiconductor devices and fabrication methods thereofVISERA TECHNOLOGIES CO LTD·Filed 2008·Application pending·0 cites
- 3541US2013141917A1Led light deviceLIN TZY-YING·Filed 2011·Application pending·0 cites
- 3639US8399969B2Chip package and fabricating method thereofCHANG KUO-CHING·Filed 2010·Granted Mar 19, 2013·0 cites·19 claims
- 3738US2006289733A1Stack-type image sensor moduleVISERA TECHNOLOGIES CO LTD·Filed 2005·Application pending·0 cites
- 3836US2006046434A1Method for reducing lead precipitation during wafer processingTAIWAN SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
- 3926US2012205695A1Light-emitting diode deviceLIN TZU-HAN·Filed 2011·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →