Inventor · disambiguated record
Raymond A. Frechette
Also filed as: FRECHETTE RAYMOND A
16 granted patents·2 pending applications·534 citations·filing 1976–2012
94Inventor score
Top patents by PatentIndex Score
18 records- 0195US5633528ALead frame structure for IC devices with strengthened encapsulation adhesionTEXAS INSTRUMENTS INC·Filed 1995·Granted May 27, 1997·207 cites·11 claims
- 0290US6365974B1Flex circuit substrate for an integrated circuit packageTEXAS INSTRUMENTS INC·Filed 2000·Granted Apr 2, 2002·73 cites·9 claims
- 0377US5891377ADambarless leadframe for molded component encapsulationTEXAS INSTRUMENTS INC·Filed 1996·Granted Apr 6, 1999·49 cites·14 claims
- 0472US4868635ALead frame for integrated circuitTEXAS INSTRUMENTS INC·Filed 1988·Granted Sep 19, 1989·50 cites·13 claims
- 0571US5429992ALead frame structure for IC devices with strengthened encapsulation adhesionTEXAS INSTRUMENTS INC·Filed 1994·Granted Jul 4, 1995·37 cites·7 claims
- 0668US7591955B2Method for forming an etched soft edge metal foil and the product thereofINTERPLEX NAS INC·Filed 2006·Granted Sep 22, 2009·2 cites·19 claims
- 0764US5949132ADambarless leadframe for molded component encapsulationTEXAS INSTRUMENTS INC·Filed 1995·Granted Sep 7, 1999·28 cites·9 claims
- 0861US5264376AMethod of making a thin film solar cellTEXAS INSTRUMENTS INC·Filed 1991·Granted Nov 23, 1993·27 cites·24 claims
- 0959US5302553AMethod of forming a coated plastic packageTEXAS INSTRUMENTS INC·Filed 1991·Granted Apr 12, 1994·22 cites·8 claims
- 1051US6302673B1Integrated circuit chip mold sealTEXAS INSTRUMENTS INC·Filed 2000·Granted Oct 16, 2001·10 cites·12 claims
- 1144US5610437ALead frame for integrated circuitsTEXAS INSTRUMENTS INC·Filed 1994·Granted Mar 11, 1997·13 cites·12 claims
- 1240US4028064ABeryllium copper plating processTEXAS INSTRUMENTS INC·Filed 1976·Granted Jun 7, 1977·6 cites·15 claims
- 1339US2013131544A1Biopsy forceps including self aligning jaws with drainage openingsANREI MEDICAL HZ CO LTD·Filed 2012·Application pending·0 cites
- 1437US2008171474A1High Density Interconnection Device With Dielectric CoatingINTERPLEX NAS INC·Filed 2006·Application pending·0 cites
- 1534US5904503AMethod of forming flat inner lead tips on lead frameTEXAS INSTRUMENTS INC·Filed 1997·Granted May 18, 1999·6 cites·16 claims
- 1633US5942178AIntegrated circuit chip mold sealTEXAS INSTRUMENTS INC·Filed 1997·Granted Aug 24, 1999·3 cites·8 claims
- 1731US5672915ACeramic coated plastic packageTEXAS INSTRUMENTS INC·Filed 1996·Granted Sep 30, 1997·1 cites·6 claims
- 1829US6302672B1Integrated circuit chip mold sealTEXAS INSTRUMENTS INC·Filed 1999·Granted Oct 16, 2001·0 cites·12 claims
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