Inventor · disambiguated record
Kriangsak Sae Le
Also filed as: LE KRIANGSAK SAE
10 granted patents·29 citations·filing 2011–2020
85Inventor score
Technology areasH10W
Files withUTAC HEADQUARTERS PTE LTD5NG CATHERINE BEE LIANG2UNITED TEST & ASSEMBLY CT LT2TOH CHIN HOCK1
Top patents by PatentIndex Score
10 records- 0190US9978658B2Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2016·Granted May 22, 2018·8 cites·18 claims
- 0285US9508623B2Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2015·Granted Nov 29, 2016·5 cites·31 claims
- 0381US8829666B2Semiconductor packages and methods of packaging semiconductor devicesNG CATHERINE BEE LIANG·Filed 2011·Granted Sep 9, 2014·8 cites·20 claims
- 0473US9117808B2Semiconductor packages and methods of packaging semiconductor devicesUNITED TEST & ASSEMBLY CT LT·Filed 2014·Granted Aug 25, 2015·3 cites·20 claims
- 0567US8703534B2Semiconductor packages and methods of packaging semiconductor devicesTOH CHIN HOCK·Filed 2012·Granted Apr 22, 2014·2 cites·20 claims
- 0663US9312240B2Semiconductor packages and methods of packaging semiconductor devicesUNITED TEST & ASSEMBLY CT LT·Filed 2014·Granted Apr 12, 2016·2 cites·17 claims
- 0757US8860079B2Semiconductor packages and methods of packaging semiconductor devicesNG CATHERINE BEE LIANG·Filed 2012·Granted Oct 14, 2014·1 cites·20 claims
- 0855US10354934B2Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2018·Granted Jul 16, 2019·0 cites·11 claims
- 0953US11139233B2Cavity wall structure for semiconductor packagingUTAC HEADQUARTERS PTE LTD·Filed 2020·Granted Oct 5, 2021·0 cites·20 claims
- 1046US10707161B2Cavity wall structure for semiconductor packagingUTAC HEADQUARTERS PTE LTD·Filed 2018·Granted Jul 7, 2020·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →