Inventor · disambiguated record
Yong Li Xu
Also filed as: XU YONG L · XU YONG LI
10 granted patents·161 citations·filing 2005–2014
90Inventor score
Technology areasH10W
Files withMAXIM INTEGRATED PRODUCTS6RAHIM S KAYSAR1SEMICONDUCTOR COMPONENTS IND1XU YONG L1XU YONG LI1
Top patents by PatentIndex Score
10 records- 0193US8643150B1Wafer-level package device having solder bump assemblies that include an inner pillar structureXU YONG L·Filed 2012·Granted Feb 4, 2014·27 cites·10 claims
- 0293US8575493B1Integrated circuit device having extended under ball metallizationXU YONG LI·Filed 2011·Granted Nov 5, 2013·41 cites·8 claims
- 0391US9087732B1Wafer-level package device having solder bump assemblies that include an inner pillar structureMAXIM INTEGRATED PRODUCTS·Filed 2014·Granted Jul 21, 2015·11 cites·9 claims
- 0490US8084871B2Redistribution layer enhancement to improve reliability of wafer level packagingRAHIM S KAYSAR·Filed 2009·Granted Dec 27, 2011·44 cites·18 claims
- 0585US9040408B1Techniques for wafer-level processing of QFN packagesMAXIM INTEGRATED PRODUCTS·Filed 2013·Granted May 26, 2015·12 cites·22 claims
- 0680US9583425B2Solder fatigue arrest for wafer level packageMAXIM INTEGRATED PRODUCTS·Filed 2013·Granted Feb 28, 2017·6 cites·8 claims
- 0778US9397027B1Sacrificial pad on semiconductor package device and methodMAXIM INTEGRATED PRODUCTS·Filed 2014·Granted Jul 19, 2016·5 cites·19 claims
- 0877US7382059B2Semiconductor package structure and method of manufactureSEMICONDUCTOR COMPONENTS IND·Filed 2005·Granted Jun 3, 2008·9 cites·19 claims
- 0975US9093333B1Integrated circuit device having extended under ball metallizationMAXIM INTEGRATED PRODUCTS·Filed 2013·Granted Jul 28, 2015·3 cites·6 claims
- 1072US9425160B1Wafer-level package device with solder bump reinforcementMAXIM INTEGRATED PRODUCTS·Filed 2013·Granted Aug 23, 2016·3 cites·10 claims
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