Inventor · disambiguated record
Yasuhiro Morikawa
Also filed as: MORIKAWA YASUHIRO
16 granted patents·14 pending applications·135 citations·filing 1994–2024
91Inventor score
Files withULVAC INC14MORIKAWA YASUHIRO6ASICS CORP3HAYASHI TOSHIO2MATSUSHITA ELECTRIC INDUSTRIAL CO LTD2
Top patents by PatentIndex Score
30 records- 0188US7728252B2Etching method and systemULVAC INC·Filed 2005·Granted Jun 1, 2010·12 cites·9 claims
- 0281US7322131B2Shoe with slip preventive memberASICS CORP·Filed 2004·Granted Jan 29, 2008·44 cites·10 claims
- 0374US12469711B2Etching methodULVAC INC·Filed 2024·Granted Nov 11, 2025·0 cites·7 claims
- 0474US7380354B2Shoe that fits to a foot with beltsASICS CORP·Filed 2004·Granted Jun 3, 2008·39 cites·10 claims
- 0570US12020942B2Etching methodULVAC INC·Filed 2022·Granted Jun 25, 2024·0 cites·6 claims
- 0670US7325336B2Wrestling shoe with separated outer solesASICS CORP·Filed 2004·Granted Feb 5, 2008·20 cites·5 claims
- 0763US8125069B2Semiconductor device and etching apparatusHAYASHI TOSHIO·Filed 2010·Granted Feb 28, 2012·1 cites·9 claims
- 0863US6828247B2Method for etching organic film, method for fabricating semiconductor device and pattern formation methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Dec 7, 2004·7 cites·22 claims
- 0961US8153926B2Etching method and systemMORIKAWA YASUHIRO·Filed 2010·Granted Apr 10, 2012·1 cites·11 claims
- 1061US6451620B2Method for etching organic film, method for fabricating semiconductor device and pattern formation methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Sep 17, 2002·6 cites·8 claims
- 1160US12205795B2Plasma processing deviceULVAC INC·Filed 2022·Granted Jan 21, 2025·0 cites·6 claims
- 1258US8993449B2Etching methodMORIKAWA YASUHIRO·Filed 2010·Granted Mar 31, 2015·1 cites·11 claims
- 1357US2025069858A1Plasma processing apparatus and control method thereforULVAC INC·Filed 2024·Application pending·0 cites
- 1455US2023420220A1Plasma processing apparatus and plasma processing methodULVAC INC·Filed 2023·Application pending·0 cites
- 1549US2015200078A1Plasma etching apparatusULVAC INC·Filed 2015·Application pending·0 cites
- 1648US12217969B2Silicon dry etching methodULVAC INC·Filed 2021·Granted Feb 4, 2025·0 cites·19 claims
- 1748US11510320B2Method of processing wiring substrateULVAC INC·Filed 2017·Granted Nov 22, 2022·0 cites·6 claims
- 1847US2022002017A1Filling packaging machine, content filling container, and manufacturing method thereforSHIKOKU KAKOKI CO LTD·Filed 2019·Application pending·0 cites
- 1947US2011180388A1Plasma Processing Method and Plasma Processing ApparatusULVAC INC·Filed 2008·Application pending·0 cites
- 2046US2010062606A1Dry etching methodULVAC INC·Filed 2008·Application pending·0 cites
- 2145US2012186746A1Plasma etching apparatusMORIKAWA YASUHIRO·Filed 2010·Application pending·0 cites
- 2245US2009261066A1Apparatus and method for dry etchingULVAC INC·Filed 2007·Application pending·0 cites
- 2344US2009277873A1Dry etching methodULVC INC·Filed 2007·Application pending·0 cites
- 2443US2010133235A1Dry etching apparatus and dry etching methodMORIKAWA YASUHIRO·Filed 2008·Application pending·0 cites
- 2542US2009102025A1Semiconductor device and method for manufacturing the same, dry-etching process, method for making electrical connections, and etching apparatusHAYASHI TOSHIO·Filed 2006·Application pending·0 cites
- 2641US2011117742A1Plasma processing methodULVAC INC·Filed 2009·Application pending·0 cites
- 2741US2010219158A1Method for dry etching interlayer insulating filmMORIKAWA YASUHIRO·Filed 2007·Application pending·0 cites
- 2839US2010133233A1Dry etching methodMORIKAWA YASUHIRO·Filed 2008·Application pending·0 cites
- 2935US5543854AVideo signal processing apparatus, video signal processing method, and video signal recording/reproduction apparatusMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Aug 6, 1996·4 cites·30 claims
- 3023US10079133B2Plasma processing deviceULVAC INC·Filed 2016·Granted Sep 18, 2018·0 cites·8 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →