Inventor · disambiguated record
Hideshi Tomita
Also filed as: TOMITA HIDESHI
20 granted patents·4 pending applications·198 citations·filing 1993–2022
95Inventor score
Top patents by PatentIndex Score
24 records- 0189US6818097B2Highly heat-resistant plasma etching electrode and dry etching device including the sameNISSHIN SPINNING·Filed 2002·Granted Nov 16, 2004·45 cites·12 claims
- 0281US6486266B2Thermosetting resin compositionNISSHIN SPINNING·Filed 2001·Granted Nov 26, 2002·16 cites·6 claims
- 0366US6103836AEpoxy resin compositionNISSHIN SPINNING·Filed 1999·Granted Aug 15, 2000·19 cites·5 claims
- 0464US6524711B2Thermosetting resin composition, and resin-covered metal foil, prepreg and film-shaped adhesive all using the compositionNISSHIN SPINNING·Filed 2001·Granted Feb 25, 2003·4 cites·21 claims
- 0564US6331226B1LCP bonding methodNISSHIN SPINNING·Filed 2000·Granted Dec 18, 2001·11 cites·5 claims
- 0663US6485833B1Resin-coated metal foilNISSHIN SPINNING·Filed 2000·Granted Nov 26, 2002·9 cites·7 claims
- 0762US12012501B2Resin composition for acoustic matching layerNISSHINBO HOLDINGS INC·Filed 2019·Granted Jun 18, 2024·0 cites·6 claims
- 0861US5679730AEpoxy resin composition and epoxy resin-based adhesiveNISSHIN SPINNING·Filed 1996·Granted Oct 21, 1997·18 cites·15 claims
- 0958US6979703B2Acoustically matching layer and composition thereofNISSHIN SPINNING·Filed 2002·Granted Dec 27, 2005·3 cites·1 claims
- 1058US6440258B1Adhesive film for semiconductor packageNISSHIN SPINNING·Filed 1999·Granted Aug 27, 2002·22 cites·4 claims
- 1157US10997961B2Acoustic lens and production method thereof, and acoustic wave probeNISSHINBO HOLDINGS INC·Filed 2018·Granted May 4, 2021·0 cites·5 claims
- 1255US2024153682A1Magnetic pasteNISSHINBO HOLDINGS INC·Filed 2022·Application pending·0 cites
- 1352US5650476AProcess for production of polycarbodiimide resin powderNISSHIN SPINNING·Filed 1995·Granted Jul 22, 1997·11 cites·8 claims
- 1448US6172143B1Resin composition for use in sealant and liquid sealant using the resin compositionNISSHIN SPINNING·Filed 1999·Granted Jan 9, 2001·9 cites·6 claims
- 1547US7253246B2Thermosetting polycarbodiimide copolymerNISSHIN SPINNING·Filed 2005·Granted Aug 7, 2007·0 cites·18 claims
- 1647US2021106311A1Backing material, production method therefor, and acoustic wave probeNISSHINBO HOLDINGS INC·Filed 2019·Application pending·0 cites
- 1744US2009314523A1Adhesive sheet with base for flexible printed wiring boards, production method therefor, multilayer flexible printed wiring board and flex-rigid printed wiring boardMATSUSHITA ELECTRIC WORKS LTD·Filed 2006·Application pending·0 cites
- 1843US6225417B1One-pack type epoxy resin compositionNISSHIN SPINNING·Filed 1999·Granted May 1, 2001·6 cites·3 claims
- 1942US6300425B1Thermosetting resin compositionNISSHIN SPINNING·Filed 1999·Granted Oct 9, 2001·6 cites·8 claims
- 2041US6387505B1Prepreg, multilayer printed wiring board and process for production of said multilayer printed wiring boardNISSHIN SPINNING·Filed 1999·Granted May 14, 2002·7 cites·7 claims
- 2141US2005064200A1Binder composition for lamination and an adhesive film using the sameFiled 2004·Application pending·0 cites
- 2238US6333101B1Method of adhering adherendsNISSHIN SPINNING·Filed 1993·Granted Dec 25, 2001·7 cites·12 claims
- 2334US6140454AAdhesive resin composition and sealing resin compositionNISSHIN SPINNING·Filed 1999·Granted Oct 31, 2000·4 cites·3 claims
- 2430US6310119B1Film-shaped encapsulating agent for electronic partsNISSHIN SPINNING·Filed 1999·Granted Oct 30, 2001·1 cites·5 claims
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