Inventor · disambiguated record
Lih-Juann Chen
Also filed as: CHEN LIH-JUANN
10 granted patents·1 pending application·603 citations·filing 1997–2006
91Inventor score
Files withUNITED MICROELECTRONICS CORP4IND TECH RES INST3TAIWAN SEMICONDUCTOR MFG2MERCK PATENT GMBH1
Top patents by PatentIndex Score
11 records- 0197US7202512B2Construction of thin strain-relaxed SiGe layers and method for fabricating the sameIND TECH RES INST·Filed 2004·Granted Apr 10, 2007·417 cites·13 claims
- 0287US6015749AMethod to improve adhesion between copper and titanium nitride, for copper interconnect structures, via the use of an ion implantation procedureTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted Jan 18, 2000·104 cites·18 claims
- 0372US6858123B1Galvanizing solution for the galvanic deposition of copperMERCK PATENT GMBH·Filed 2000·Granted Feb 22, 2005·10 cites·8 claims
- 0462US7498224B2Strained silicon forming method with reduction of threading dislocation densityIND TECH RES INST·Filed 2006·Granted Mar 3, 2009·1 cites·6 claims
- 0560US6417118B1Method for improving the moisture absorption of porous low dielectric filmUNITED MICROELECTRONICS CORP·Filed 2001·Granted Jul 9, 2002·16 cites·20 claims
- 0653US6043148AMethod of fabricating contact plugUNITED MICROELECTRONICS CORP·Filed 1998·Granted Mar 28, 2000·21 cites·15 claims
- 0750US6083829AUse of a low resistivity Cu3 Ge interlayer as an adhesion promoter between copper and tin layersTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted Jul 4, 2000·16 cites·26 claims
- 0847US6022457AMethod of manufacturing cobalt silicide layerUNITED MICROELECTRONICS CORP·Filed 1998·Granted Feb 8, 2000·11 cites·9 claims
- 0943US7102153B2Strained silicon forming method with reduction of threading dislocation densityIND TECH RES INST·Filed 2004·Granted Sep 5, 2006·0 cites·7 claims
- 1041US5897373AMethod of manufacturing semiconductor components having a titanium nitride layerUNITED MICROELECTRONICS CORP·Filed 1997·Granted Apr 27, 1999·7 cites·12 claims
- 1128US2003045038A1Method of forming low-temperature polysiliconFiled 2001·Application pending·0 cites
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