Inventor · disambiguated record
Tim J. Corbett
Also filed as: CORBETT TIM · CORBETT TIM J
59 granted patents·3 pending applications·3,020 citations·filing 1988–2013
99Inventor score
Top patents by PatentIndex Score
62 records- 0199US4899107ADiscrete die burn-in for nonpackaged dieMICRON TECHNOLOGY INC·Filed 1988·Granted Feb 6, 1990·308 cites·16 claims
- 0298US5138434APackaging for semiconductor logic devicesMICRON TECHNOLOGY INC·Filed 1991·Granted Aug 11, 1992·327 cites·13 claims
- 0398US4992850ADirectly bonded simm moduleMICRON TECHNOLOGY INC·Filed 1989·Granted Feb 12, 1991·233 cites·13 claims
- 0496US4992849ADirectly bonded board multiple integrated circuit moduleMICRON TECHNOLOGY INC·Filed 1989·Granted Feb 12, 1991·175 cites·28 claims
- 0595US6320201B1Semiconductor reliability test chipMICRON TECHNOLOGY INC·Filed 2000·Granted Nov 20, 2001·76 cites·44 claims
- 0695US5302891ADiscrete die burn-in for non-packaged dieMICRON TECHNOLOGY INC·Filed 1992·Granted Apr 12, 1994·224 cites·43 claims
- 0794US6087845AUniversal wafer carrier for wafer level die burn-inMICRON TECHNOLOGY INC·Filed 1998·Granted Jul 11, 2000·88 cites·29 claims
- 0894USRE36469EPackaging for semiconductor logic devicesMICRON TECHNOLOGY INC·Filed 1995·Granted Dec 28, 1999·181 cites·13 claims
- 0994US5985377ALaser marking techniquesMICRON TECHNOLOGY INC·Filed 1997·Granted Nov 16, 1999·89 cites·49 claims
- 1093US6091251ADiscrete die burn-in for nonpackaged dieFiled 1997·Granted Jul 18, 2000·125 cites·10 claims
- 1192US8169436B2Methods and systems for remoting three dimensional graphicsRIVERA JUAN·Filed 2009·Granted May 1, 2012·27 cites·33 claims
- 1291US8126156B2Calibrating at least one system microphoneCORBETT TIM·Filed 2008·Granted Feb 28, 2012·76 cites·20 claims
- 1391US5905382AUniversal wafer carrier for wafer level die burn-inMICRON TECHNOLOGY INC·Filed 1996·Granted May 18, 1999·59 cites·4 claims
- 1491US5751015ASemiconductor reliability test chipMICRON TECHNOLOGY INC·Filed 1995·Granted May 12, 1998·79 cites·52 claims
- 1589US5548160AMethod and structure for attaching a semiconductor die to a lead frameMICRON TECHNOLOGY INC·Filed 1994·Granted Aug 20, 1996·80 cites·28 claims
- 1688US6535012B1Universal wafer carrier for wafer level die burn-inMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 18, 2003·20 cites·4 claims
- 1787US6737882B2Method for universal wafer carrier for wafer level die burn-inMICRON TECHNOLOGY INC·Filed 2002·Granted May 18, 2004·17 cites·4 claims
- 1887US6217949B1Laser marking techniquesMICRON TECHNOLOGY INC·Filed 2000·Granted Apr 17, 2001·23 cites·39 claims
- 1987US5859539AUniversal wafer carrier for wafer level die burn-inMICRON TECHNOLOGY INC·Filed 1997·Granted Jan 12, 1999·41 cites·15 claims
- 2087US5726580AUniversal wafer carrier for wafer level die burn-inMICRON TECHNOLOGY INC·Filed 1996·Granted Mar 10, 1998·43 cites·26 claims
- 2187US5663654AUniversal wafer carrier for wafer level die burn-inMICRON TECHNOLOGY INC·Filed 1996·Granted Sep 2, 1997·44 cites·33 claims
- 2286US6538264B2Semiconductor reliability test chipMICRON TECHNOLOGY INC·Filed 2001·Granted Mar 25, 2003·23 cites·44 claims
- 2385US5936260ASemiconductor reliability test chipMICRON TECHNOLOGY INC·Filed 1997·Granted Aug 10, 1999·50 cites·44 claims
- 2485US5539324AUniversal wafer carrier for wafer level die burn-inMICRON TECHNOLOGY INC·Filed 1992·Granted Jul 23, 1996·95 cites·2 claims
- 2583US6770906B2Semiconductor reliability test chipMICRON TECHNOLOGY INC·Filed 2003·Granted Aug 3, 2004·18 cites·16 claims
- 2683US6108026ALaser marking techniquesMICRON TECHNOLOGY INC·Filed 1998·Granted Aug 22, 2000·35 cites·41 claims
- 2781US5838361ALaser marking techniquesMICRON TECHNOLOGY INC·Filed 1996·Granted Nov 17, 1998·34 cites·4 claims
- 2881US5585282AProcess for forming a raised portion on a projecting contact for electrical testing of a semiconductorMICRON TECHNOLOGY INC·Filed 1995·Granted Dec 17, 1996·64 cites·20 claims
- 2980US6157046ASemiconductor reliability test chipMICRON TECHNOLOGY INC·Filed 1999·Granted Dec 5, 2000·37 cites·44 claims
- 3080US6113992ALaser making techniquesMICRON TECHNOLOGY INC·Filed 1999·Granted Sep 5, 2000·29 cites·49 claims
- 3180US5767443AMulti-die encapsulation deviceMICRON TECHNOLOGY INC·Filed 1994·Granted Jun 16, 1998·37 cites·26 claims
- 3278US7112986B2Method for testing using a universal wafer carrier for wafer level die burn-inMICRON TECHNOLOGY INC·Filed 2005·Granted Sep 26, 2006·2 cites·4 claims
- 3378US5781022ASubstrate having self limiting contacts for establishing an electrical connection with a semiconductor dieMICRON TECHNOLOGY INC·Filed 1996·Granted Jul 14, 1998·53 cites·18 claims
- 3475US8187983B2Methods for fabricating semiconductor components using thinning and back side laser processingWOOD ALAN G·Filed 2009·Granted May 29, 2012·3 cites·19 claims
- 3575US6461690B2Laser marking techniquesMICRON TECHNOLOGY INC·Filed 2001·Granted Oct 8, 2002·10 cites·21 claims
- 3674US6342912B1Laser marking techniquesMICRON TECHNOLOGY INC·Filed 2000·Granted Jan 29, 2002·10 cites·35 claims
- 3774US5945733AStructure for attaching a semiconductor wafer section to a supportMICRON TECHNOLOGY INC·Filed 1997·Granted Aug 31, 1999·33 cites·21 claims
- 3872US7452732B2Comparing identifying indicia formed using laser marking techniques to an identifying indicia modelMICRON TECHNOLOGY INC·Filed 2003·Granted Nov 18, 2008·8 cites·27 claims
- 3970US6091254AUniversal wafer carrier for wafer level die burn-inMICRON TECHNOLOGY INC·Filed 1998·Granted Jul 18, 2000·16 cites·5 claims
- 4069US6342789B1Universal wafer carrier for wafer level die burn-inMICRON TECHNOLOGY INC·Filed 1998·Granted Jan 29, 2002·15 cites·8 claims
- 4168US8530895B2Thinned semiconductor components having lasered features and method of fabricationWOOD ALAN G·Filed 2012·Granted Sep 10, 2013·1 cites·16 claims
- 4268US6091250ADiscrete die burn-in for nonpackaged dieMICRON TECHNOLOGY INC·Filed 1994·Granted Jul 18, 2000·33 cites·13 claims
- 4366US6429890B1Laser marking techniquesMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 6, 2002·6 cites·34 claims
- 4463USRE36325EDirectly bonded SIMM moduleMICRON TECHNOLOGY INC·Filed 1995·Granted Oct 5, 1999·30 cites·13 claims
- 4563US5656551AMethod for attaching a semiconductor die to a supportMICRON TECHNOLOGY INC·Filed 1996·Granted Aug 12, 1997·21 cites·20 claims
- 4662US8350863B2Methods and systems for improving resource utilization by delaying rendering of three dimensional graphicsCITRIX SYSTEMS INC·Filed 2009·Granted Jan 8, 2013·1 cites·20 claims
- 4758US8728921B2Method for fabricating semiconductor components having lasered features containing dopantsMICRON TECHNOLOGY INC·Filed 2013·Granted May 20, 2014·0 cites·20 claims
- 4858US2007103180A1Universal wafer carrier for wafer level die burn-inWOOD ALAN G·Filed 2006·Application pending·0 cites
- 4957US7167014B2Method for testing using a universal wafer carrier for wafer level die burn-inMICRON TECHNOLOGY INC·Filed 2005·Granted Jan 23, 2007·0 cites·4 claims
- 5057US7161373B2Method for testing using a universal wafer carrier for wafer level die burn-inMICRON TECHNOLOGY INC·Filed 2005·Granted Jan 9, 2007·0 cites·4 claims
Showing the top 50 of 62 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →