Inventor · disambiguated record
Kun-Tzu Lin
Also filed as: LIN KUN · LIN KUN-TZU
9 granted patents·2 pending applications·32 citations·filing 2002–2022
81Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD4JIN YUNCHENG ENTPR CO LTD3TAIWAN SEMICONDUCTOR MFG3UNIV BEIJING SCIENCE & TECHNOLOGY1
Top patents by PatentIndex Score
11 records- 0189US10020401B2Methods for straining a transistor gate through interlayer dielectric (ILD) doping schemesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 10, 2018·4 cites·20 claims
- 0278US12100767B2Strained gate semiconductor device having an interlayer dielectric doped with large species materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 24, 2024·0 cites·20 claims
- 0378US6634177B2Apparatus for the real-time monitoring and control of a wafer temperatureTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Oct 21, 2003·28 cites·14 claims
- 0471US11271114B2Strained gate semiconductor device with oxygen-doped interlayer dielectric materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 8, 2022·0 cites·20 claims
- 0562US10672909B2Strained gate semiconductor device having an interlayer dielectric doped with oxygen and a large species materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 2, 2020·0 cites·20 claims
- 0650US2021189530A1Plastic single-axis zero-expansion composite material and preparation method thereofUNIV BEIJING SCIENCE & TECHNOLOGY·Filed 2020·Application pending·0 cites
- 0742US2022203418A1Method for manufacturing cold-forged extruded aluminum alloy rodJIN YUNCHENG ENTPR CO LTD·Filed 2021·Application pending·0 cites
- 0836US11638943B2Method for manufacturing cold-forged, extruded aluminum alloy tubeJIN YUNCHENG ENTPR CO LTD·Filed 2020·Granted May 2, 2023·0 cites·14 claims
- 0934US11872616B2Method for manufacturing cold-forged, extruded aluminum alloy tubeJIN YUNCHENG ENTPR CO LTD·Filed 2019·Granted Jan 16, 2024·0 cites·9 claims
- 1033US7416607B2Fluid injection apparatus for semiconductor processingTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Aug 26, 2008·0 cites·22 claims
- 1129US7066074B2Fluid motorTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Jun 27, 2006·0 cites·17 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →