Inventor · disambiguated record
Jisun Hong
Also filed as: HONG JISUN
4 granted patents·7 citations·filing 2011–2018
64Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0173US10032706B2Package substratesSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jul 24, 2018·2 cites·13 claims
- 0272US8558371B2Method for wafer level package and semiconductor device fabricated using the sameHONG JISUN·Filed 2011·Granted Oct 15, 2013·5 cites·16 claims
- 0353US10256181B2Package substratesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Apr 9, 2019·0 cites·20 claims
- 0444US9112062B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Aug 18, 2015·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →