Inventor · disambiguated record
Min Yu Chan
Also filed as: CHAN MIN Y · CHAN MIN YU
17 granted patents·1,462 citations·filing 1992–2014
96Inventor score
Technology areasH10W
Top patents by PatentIndex Score
17 records- 0197US6882021B2Packaged image sensing microelectronic devices including a lead and methods of packaging image sensing microelectronic devices including a leadMICRON TECHNOLOGY INC·Filed 2003·Granted Apr 19, 2005·157 cites·38 claims
- 0295US6137164AThin stacked integrated circuit deviceTEXAS INSTRUMENTS INC·Filed 1999·Granted Oct 24, 2000·326 cites·10 claims
- 0395US5952611AFlexible pin location integrated circuit packageTEXAS INSTRUMENTS INC·Filed 1997·Granted Sep 14, 1999·216 cites·19 claims
- 0493US5461255AMulti-layered lead frame assembly for integrated circuitsTEXAS INSTRUMENTS INC·Filed 1994·Granted Oct 24, 1995·151 cites·7 claims
- 0592US6365833B1Integrated circuit packageTEXAS INSTRUMENTS INC·Filed 2000·Granted Apr 2, 2002·70 cites·7 claims
- 0689US6387729B2Method for adhering and sealing a silicon chip in an integrated circuit packageTEXAS INSTRUMENTS INC·Filed 2001·Granted May 14, 2002·48 cites·5 claims
- 0787US6049129AChip size integrated circuit packageTEXAS INSTRUMENTS INC·Filed 1997·Granted Apr 11, 2000·108 cites·36 claims
- 0885US6468831B2Method of fabricating thin integrated circuit unitsTEXAS INSTRUMENTS INC·Filed 2001·Granted Oct 22, 2002·43 cites·9 claims
- 0985US6218202B1Semiconductor device testing and burn-in methodologyTEXAS INSTRUMENTS INC·Filed 1998·Granted Apr 17, 2001·101 cites·7 claims
- 1080US6177723B1Integrated circuit package and flat plate molding process for integrated circuit packageTEXAS INSTRUMENTS INC·Filed 1997·Granted Jan 23, 2001·64 cites·9 claims
- 1179US6087203AMethod for adhering and sealing a silicon chip in an integrated circuit packageTEXAS INSTRUMENTS INC·Filed 1997·Granted Jul 11, 2000·45 cites·8 claims
- 1269US6274929B1Stacked double sided integrated circuit packageTEXAS INSTRUMENTS INC·Filed 1998·Granted Aug 14, 2001·35 cites·12 claims
- 1367US6236107B1Encapsulate resin LOC package and method of fabricationTEXAS INSTRUMENTS INC·Filed 1995·Granted May 22, 2001·33 cites·12 claims
- 1466US5647124AMethod of attachment of a semiconductor slotted lead to a substrateTEXAS INSTRUMENTS INC·Filed 1995·Granted Jul 15, 1997·29 cites·6 claims
- 1564US9418872B2Packaged microelectronic componentsMICRON TECHNOLOGY INC·Filed 2014·Granted Aug 16, 2016·1 cites·21 claims
- 1652US5293065ALead frame having an outlet with a larger cross sectional area than the inletTEXAS INSTRUMENTS INC·Filed 1992·Granted Mar 8, 1994·20 cites·5 claims
- 1751US6040623ASlotted lead for a semiconductor deviceTEXAS INSTRUMENTS INC·Filed 1997·Granted Mar 21, 2000·15 cites·6 claims
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