Inventor · disambiguated record
Krishnan Shrinivasan
Also filed as: SHRINIVASAN KRISHNAN
20 granted patents·2 pending applications·1,802 citations·filing 1999–2015
97Inventor score
Files withNOVELLUS SYSTEMS INC16SHRINIVASAN KRISHNAN3GASONICS INTERNAT CORP1HAVERKAMP JASON1KELMAN MAXIM1
Top patents by PatentIndex Score
22 records- 0196US7327948B1Cast pedestal with heating element and coaxial heat exchangerNOVELLUS SYSTEMS INC·Filed 2005·Granted Feb 5, 2008·582 cites·22 claims
- 0296US6848455B1Method and apparatus for removing photoresist and post-etch residue from semiconductor substrates by in-situ generation of oxidizing speciesNOVELLUS SYSTEMS INC·Filed 2002·Granted Feb 1, 2005·113 cites·28 claims
- 0396US6848458B1Apparatus and methods for processing semiconductor substrates using supercritical fluidsNOVELLUS SYSTEMS INC·Filed 2002·Granted Feb 1, 2005·162 cites·59 claims
- 0495US8629068B1Multi-station sequential curing of dielectric filmsSHRINIVASAN KRISHNAN·Filed 2013·Granted Jan 14, 2014·25 cites·3 claims
- 0595US8454750B1Multi-station sequential curing of dielectric filmsSHRINIVASAN KRISHNAN·Filed 2007·Granted Jun 4, 2013·37 cites·22 claims
- 0695US7503334B1Apparatus and methods for processing semiconductor substrates using supercritical fluidsNOVELLUS SYSTEMS INC·Filed 2005·Granted Mar 17, 2009·49 cites·13 claims
- 0794US7941039B1Pedestal heat transfer and temperature controlNOVELLUS SYSTEMS INC·Filed 2007·Granted May 10, 2011·36 cites·15 claims
- 0894US6764552B1Supercritical solutions for cleaning photoresist and post-etch residue from low-k materialsNOVELLUS SYSTEMS INC·Filed 2002·Granted Jul 20, 2004·149 cites·25 claims
- 0994US6550484B1Apparatus for maintaining wafer back side and edge exclusion during supercritical fluid processingNOVELLUS SYSTEMS INC·Filed 2001·Granted Apr 22, 2003·91 cites·39 claims
- 1093US6228563B1Method and apparatus for removing post-etch residues and other adherent matricesGASONICS INTERNAT CORP·Filed 1999·Granted May 8, 2001·218 cites·20 claims
- 1192US6333268B1Method and apparatus for removing post-etch residues and other adherent matricesNOVELLUS SYSTEMS INC·Filed 2000·Granted Dec 25, 2001·117 cites·10 claims
- 1291US8980769B1Multi-station sequential curing of dielectric filmsHAVERKAMP JASON·Filed 2007·Granted Mar 17, 2015·19 cites·16 claims
- 1391US6800142B1Method for removing photoresist and post-etch residue using activated peroxide followed by supercritical fluid treatmentNOVELLUS SYSTEMS INC·Filed 2002·Granted Oct 5, 2004·57 cites·46 claims
- 1491US6563092B1Measurement of substrate temperature in a process chamber using non-contact filtered infrared pyrometryNOVELLUS SYSTEMS INC·Filed 2001·Granted May 13, 2003·73 cites·28 claims
- 1588US8951348B1Single-chamber sequential curing of semiconductor wafersSHRINIVASAN KRISHNAN·Filed 2012·Granted Feb 10, 2015·8 cites·20 claims
- 1687US8889233B1Method for reducing stress in porous dielectric filmsKELMAN MAXIM·Filed 2006·Granted Nov 18, 2014·16 cites·26 claims
- 1783US9873946B2Multi-station sequential curing of dielectric filmsNOVELLUS SYSTEMS INC·Filed 2015·Granted Jan 23, 2018·3 cites·18 claims
- 1882US9835388B2Systems for uniform heat transfer including adaptive portionsNOVELLUS SYSTEMS INC·Filed 2012·Granted Dec 5, 2017·8 cites·11 claims
- 1975US6905556B1Method and apparatus for using surfactants in supercritical fluid processing of wafersNOVELLUS SYSTEMS INC·Filed 2002·Granted Jun 14, 2005·19 cites·12 claims
- 2074US7105061B1Method and apparatus for sealing substrate load port in a high pressure reactorNOVELLUS SYSTEMS INC·Filed 2001·Granted Sep 12, 2006·20 cites·10 claims
- 2154US2014080324A1Multi-station sequential curing of dielectric filmsNOVELLUS SYSTEMS INC·Filed 2013·Application pending·0 cites
- 2238US2008264443A1Apparatus and methods for increasing the rate of solute concentration evolution in a supercritical process chamberNOVELLUS SYSTEMS INC·Filed 2004·Application pending·0 cites
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