Inventor · disambiguated record
Soon Gyu Yim
Also filed as: YIM SOON GYU
12 granted patents·15 pending applications·32 citations·filing 2008–2014
87Inventor score
Top patents by PatentIndex Score
27 records- 0180US8064215B2Semiconductor chip package and printed circuit boardCHUNG YUL-KYO·Filed 2008·Granted Nov 22, 2011·11 cites·4 claims
- 0274US8159071B2Semiconductor package with a metal postKIM WOON-CHUN·Filed 2009·Granted Apr 17, 2012·5 cites·1 claims
- 0368US9153641B2Wafer level package having cylindrical capacitor and method of fabricating the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Oct 6, 2015·2 cites·6 claims
- 0468US8786064B2Semiconductor package and method for manufacturing the same and semiconductor package module having the sameKIM JIN SU·Filed 2012·Granted Jul 22, 2014·3 cites·20 claims
- 0568US8656582B2Method of attaching die using self-assembling monolayer and package substrate including die attached thereto using self-assembling monolayerLEE SEUNG SEOUP·Filed 2009·Granted Feb 25, 2014·4 cites·11 claims
- 0668US8366008B2Radio frequency identification tag, and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2010·Granted Feb 5, 2013·3 cites·9 claims
- 0767US8130508B2Electronic component embedded printed circuit board and manufacturing method thereofKIM WOON-CHUN·Filed 2009·Granted Mar 6, 2012·3 cites·3 claims
- 0862US2011061707A1Dye-sensitized solar cells and mobile device including the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 0962US2011061727A1Dye-sensitized solar cells and mobile device including the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1061US8378452B2Wafer level package having cylindrical capacitor and method of fabricating the sameSAMSUNG ELECTRO MECH·Filed 2010·Granted Feb 19, 2013·1 cites·3 claims
- 1151US2010140100A1Manufacturing method of printed circuit boardSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1251US2010288739A1Laser processing deviceSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1350US8409981B2Semiconductor package with a metal post and manufacturing method thereofKIM WOON-CHUN·Filed 2012·Granted Apr 2, 2013·0 cites·3 claims
- 1450US8266792B2Method of manufacturing a printed circuit board with an embedded electronic componentKIM WOON-CHUN·Filed 2012·Granted Sep 18, 2012·0 cites·4 claims
- 1550US2009321118A1Printed circuit board embedded chip and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1650US2010051322A1Printed circuit board and manufacturing methodSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1749US2011124382A1Mobile phoneSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 1848US8866288B2Semiconductor packageSAMSUNG ELECTRO MECH·Filed 2013·Granted Oct 21, 2014·0 cites·11 claims
- 1948US2011061904A1Display array substrate and method of manufacturing display substrateSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 2046US2010059881A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 2146US2012042513A1Manufacturing method of printed circuit board embedded chipKIM WOON CHUN·Filed 2011·Application pending·0 cites
- 2245US2015128697A1Mems device packageSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2344US2010142116A1CapacitorSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 2444US2010214719A1Capacitor and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 2538US8471581B2Apparatus and method for inspecting defects in circuit pattern of substrateLEE SEUNG SEOUP·Filed 2010·Granted Jun 25, 2013·0 cites·8 claims
- 2637US2011128709A1Display array substrate and method of manufacturing display substrateSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 2734US2011043363A1Radio frequency identification tag, and method and mold for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
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