Inventor · disambiguated record
Hirohisa Nakayama
Also filed as: NAKAYAMA HIROHISA
3 granted patents·1 pending application·215 citations·filing 2001–2006
75Inventor score
Files withSEIKO EPSON CORP4
Top patents by PatentIndex Score
4 records- 0196US6621172B2Semiconductor device and method of fabricating the same, circuit board, and electronic equipmentSEIKO EPSON CORP·Filed 2001·Granted Sep 16, 2003·169 cites·24 claims
- 0283US7230329B2Semiconductor device, electronic device, electronic equipment, method of manufacturing semiconductor device, and method of manufacturing electronic deviceSEIKO EPSON CORP·Filed 2004·Granted Jun 12, 2007·43 cites·11 claims
- 0364US7608479B2Method of manufacturing semiconductor device and method of treating electrical connection sectionSEIKO EPSON CORP·Filed 2006·Granted Oct 27, 2009·3 cites·13 claims
- 0433US2004075163A1Semiconductor device and method of manufacturing the same, circuit board, and electronic instrumentSEIKO EPSON CORP·Filed 2003·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →