Inventor · disambiguated record
Suangwu Huang
Also filed as: HUANG SHUANGWU · HUANG SUANGWU
8 granted patents·334 citations·filing 2002–2006
90Inventor score
Technology areasH10W
Files withMICRON TECHNOLOGY INC8
Top patents by PatentIndex Score
8 records- 0198US7485562B2Method of making multichip wafer level packages and computing systems incorporating sameMICRON TECHNOLOGY INC·Filed 2005·Granted Feb 3, 2009·141 cites·18 claims
- 0292US6964881B2Multi-chip wafer level system packages and methods of forming sameMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 15, 2005·51 cites·13 claims
- 0391US7173330B2Multiple chip semiconductor packageMICRON TECHNOLOGY INC·Filed 2005·Granted Feb 6, 2007·17 cites·21 claims
- 0490US6825553B2Multichip wafer level packages and computing systems incorporating sameMICRON TECHNOLOGY INC·Filed 2003·Granted Nov 30, 2004·44 cites·26 claims
- 0586US6958537B2Multiple chip semiconductor packageMICRON TECHNOLOGY INC·Filed 2004·Granted Oct 25, 2005·32 cites·18 claims
- 0684US6987031B2Multiple chip semiconductor package and method of fabricating sameMICRON TECHNOLOGY INC·Filed 2002·Granted Jan 17, 2006·27 cites·32 claims
- 0782US7087992B2Multichip wafer level packages and computing systems incorporating sameMICRON TECHNOLOGY INC·Filed 2004·Granted Aug 8, 2006·21 cites·25 claims
- 0862US7553697B2Multiple chip semiconductor packageMICRON TECHNOLOGY INC·Filed 2006·Granted Jun 30, 2009·1 cites·16 claims
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