Inventor · disambiguated record
Seiichi Tomihara
Also filed as: TOMIHARA SEIICHI
5 granted patents·2 pending applications·122 citations·filing 2001–2003
83Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0191US6649448B2Method of manufacturing a semiconductor device having flexible wiring substrateHITACHI LTD·Filed 2001·Granted Nov 18, 2003·81 cites·5 claims
- 0269US6664647B2Semiconductor device and a method of manufacturing the sameHITACHI LTD·Filed 2002·Granted Dec 16, 2003·12 cites·6 claims
- 0366US6897093B2Method of manufacturing a resin molded or encapsulation for small outline non-leaded (SON) or quad flat non-leaded (QFN) packageHITACHI HOKKAI SEMICONDUCTOR·Filed 2003·Granted May 24, 2005·11 cites·9 claims
- 0466US6800507B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2002·Granted Oct 5, 2004·11 cites·23 claims
- 0556US6902955B2Method of manufacturing a semiconductor device having a flexible wiring substrateRENESAS TECH CORP·Filed 2003·Granted Jun 7, 2005·7 cites·11 claims
- 0638US2002020929A1Semiconductor device and a method of manufacturing the sameHITACHI LTD·Filed 2001·Application pending·0 cites
- 0732US2003006492A1Semiconductor device and method of manufacturing the sameFiled 2002·Application pending·0 cites
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