Inventor · disambiguated record
Jun-Won Han
Also filed as: HAN JUN-WON
5 granted patents·1 pending application·7 citations·filing 2014–2021
68Inventor score
Top patents by PatentIndex Score
6 records- 0174US9076701B2Wafer supporting structure, intermediate structure of a semiconductor package including the wafer supporting structureSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jul 7, 2015·4 cites·3 claims
- 0271US10692820B2Hybrid composite film, method of fabricating the same, and integrated circuit device including hybrid composite filmSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 23, 2020·2 cites·14 claims
- 0364US9458365B2Temporary bonding adhesive compositions and methods of manufacturing a semiconductor device using the sameSHINETSU CHEMICAL CO·Filed 2014·Granted Oct 4, 2016·1 cites·18 claims
- 0455US12479865B2Organic compound, organic photoelectric device, image sensor, and electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 25, 2025·0 cites·17 claims
- 0547US9627205B2Method of manufacturing a semiconductor device using purified block copolymers and semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Apr 18, 2017·0 cites·20 claims
- 0643US2015115436A1Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →