Inventor · disambiguated record
Wendy L. Wilkins
Also filed as: WILKINS WENDY L · WILKINS WENDY LEE
3 granted patents·1 pending application·17 citations·filing 2003–2006
66Inventor score
Top patents by PatentIndex Score
4 records- 0178US7642644B2Packaging for high power integrated circuitsMAYO FOUNDATION·Filed 2005·Granted Jan 5, 2010·10 cites·11 claims
- 0263US7656028B2System for controlling the temperature of an associated electronic device using an enclosure having a working fluid arranged therein and a chemical compound in the working fluid that undergoes a reversible chemical reaction to move heat from the associated electronic deviceMAYO FOUNDATION·Filed 2006·Granted Feb 2, 2010·3 cites·28 claims
- 0344US7431705B2Die-first multi-chip modules and methods of manufactureUNION SEMICONDUCTOR TECHNOLOGY·Filed 2003·Granted Oct 7, 2008·4 cites·31 claims
- 0432US2004195669A1Integrated circuit packaging apparatus and methodFiled 2003·Application pending·0 cites
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