Inventor · disambiguated record
Shuji Kawaguchi
Also filed as: KAWAGUCHI SHUJI
19 granted patents·15 pending applications·111 citations·filing 2005–2024
92Inventor score
Top patents by PatentIndex Score
34 records- 0196US7411861B2Integrated circuit device and electronic instrumentSEIKO EPSON CORP·Filed 2005·Granted Aug 12, 2008·26 cites·16 claims
- 0293US7471573B2Integrated circuit device and electronic instrumentSEIKO EPSON CORP·Filed 2005·Granted Dec 30, 2008·13 cites·20 claims
- 0392USD583481SCuvetteSYSMEX CORP·Filed 2007·Granted Dec 23, 2008·52 cites·1 claims
- 0482US12424752B2Wiring board and method for manufacturing wiring boardDAINIPPON PRINTING CO LTD·Filed 2021·Granted Sep 23, 2025·1 cites·18 claims
- 0581US2025016928A1Wiring board and method for manufacturing wiring boardDAINIPPON PRINTING CO LTD·Filed 2024·Application pending·0 cites
- 0677US9625482B2Sample analyzerSYSMEX CORP·Filed 2013·Granted Apr 18, 2017·2 cites·13 claims
- 0776US10797643B2Oscillation circuit, microcomputer and electronic deviceSEIKO EPSON CORP·Filed 2018·Granted Oct 6, 2020·2 cites·16 claims
- 0876US7593270B2Integrated circuit device and electronic instrumentSEIKO EPSON CORP·Filed 2005·Granted Sep 22, 2009·3 cites·18 claims
- 0976US7495988B2Integrated circuit device and electronic instrumentSEIKO EPSON CORP·Filed 2005·Granted Feb 24, 2009·3 cites·18 claims
- 1073US7388803B2Integrated circuit device and electronic instrumentSEIKO EPSON CORP·Filed 2005·Granted Jun 17, 2008·2 cites·26 claims
- 1172US7782694B2Integrated circuit device and electronic instrumentSEIKO EPSON CORP·Filed 2006·Granted Aug 24, 2010·2 cites·14 claims
- 1271US12156337B2Wiring board and method for manufacturing wiring boardDAINIPPON PRINTING CO LTD·Filed 2021·Granted Nov 26, 2024·0 cites·18 claims
- 1370US11333675B2Method and sample analyzer for detecting that a tip end of a pipette contacts a surface of a liquidSYSMEX CORP·Filed 2019·Granted May 17, 2022·0 cites·17 claims
- 1467US7986541B2Integrated circuit device and electronic instrumentSEIKO EPSON CORP·Filed 2005·Granted Jul 26, 2011·1 cites·17 claims
- 1567US7616520B2Integrated circuit device and electronic instrumentSEIKO EPSON CORP·Filed 2005·Granted Nov 10, 2009·1 cites·15 claims
- 1666US7613066B2Integrated circuit device and electronic instrumentSEIKO EPSON CORP·Filed 2006·Granted Nov 3, 2009·1 cites·10 claims
- 1762US7859928B2Integrated circuit device and electronic instrumentSEIKO EPSON CORP·Filed 2008·Granted Dec 28, 2010·0 cites·11 claims
- 1861US7492659B2Integrated circuit device and electronic instrumentSEIKO EPSON CORP·Filed 2005·Granted Feb 17, 2009·2 cites·14 claims
- 1960US2017176485A1Sample analyzerSYSMEX CORP·Filed 2017·Application pending·0 cites
- 2059US2008112254A1Integrated circuit device and electronic instrumentSEIKO EPSON CORP·Filed 2007·Application pending·0 cites
- 2151US2024258690A1Wiring board, module, and image display apparatusDAINIPPON PRINTING CO LTD·Filed 2024·Application pending·0 cites
- 2248US10714243B2Variable resistance circuit, oscillator circuit, and semiconductor deviceSEIKO EPSON CORP·Filed 2019·Granted Jul 14, 2020·0 cites·12 claims
- 2348US2007013706A1Integrated circuit device and electronic instrumentSEIKO EPSON CORP·Filed 2006·Application pending·0 cites
- 2447US2007001970A1Integrated circuit device and electronic instrumentSEIKO EPSON CORP·Filed 2005·Application pending·0 cites
- 2547US2023375833A1Head mounted displayDAINIPPON PRINTING CO LTD·Filed 2021·Application pending·0 cites
- 2647US2007001968A1Display device and electronic instrumentSEIKO EPSON CORP·Filed 2005·Application pending·0 cites
- 2744US2019367983A1Pcr primer set for hla gene, and sequencing method using sameUNIV KYOTO·Filed 2018·Application pending·0 cites
- 2842US2025013089A1Image display device laminate, image display device, and moduleDAINIPPON PRINTING CO LTD·Filed 2022·Application pending·0 cites
- 2942US2024235004A1Wiring board, method for manufacturing wiring board, laminate for image display device, and image display deviceDAINIPPON PRINTING CO LTD·Filed 2022·Application pending·0 cites
- 3041US2023318203A1Wiring board and method of manufacturing wiring boardDAINIPPON PRINTING CO LTD·Filed 2021·Application pending·0 cites
- 3141US2024121999A1Multilayer body for image display device and image display deviceDAINIPPON PRINTING CO LTD·Filed 2022·Application pending·0 cites
- 3240US2024188227A1Wiring board and method of manufacturing wiring boardDAINIPPON PRINTING CO LTD·Filed 2022·Application pending·0 cites
- 3335US11333802B2Lens sheet, lens sheet unit, imaging module, imaging deviceDAINIPPON PRINTING CO LTD·Filed 2016·Granted May 17, 2022·0 cites·14 claims
- 3435US2007016700A1Integrated circuit device and electronic instrumentSEIKO EPSON CORP·Filed 2006·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →