Inventor · disambiguated record
Diane Hymes
Also filed as: HYMES DIANE · HYMES DIANE J
27 granted patents·14 pending applications·549 citations·filing 1997–2024
97Inventor score
Files withLAM RES CORP34MOORING BEN2ONTRAK SYSTEMS INC2BATTELLE MEMORIAL INST A PART1SIRARD STEPHEN M1
Top patents by PatentIndex Score
41 records- 0192US8898928B2Delamination drying apparatus and methodLAM RES CORP·Filed 2012·Granted Dec 2, 2014·18 cites·19 claims
- 0292US6303551B1Cleaning solution and method for cleaning semiconductor substrates after polishing of cooper filmLAM RES CORP·Filed 2000·Granted Oct 16, 2001·55 cites·7 claims
- 0390US11862473B2Controlled degradation of a stimuli-responsive polymer filmLAM RES CORP·Filed 2021·Granted Jan 2, 2024·2 cites·37 claims
- 0486US6423200B1Copper interconnect seed layer treatment methods and apparatuses for treating the sameLAM RES CORP·Filed 1999·Granted Jul 23, 2002·57 cites·18 claims
- 0584US9673037B2Substrate freeze dry apparatus and methodSIRARD STEPHEN M·Filed 2011·Granted Jun 6, 2017·9 cites·11 claims
- 0684US9627608B2Dielectric repair for emerging memory devicesLAM RES CORP·Filed 2014·Granted Apr 18, 2017·2 cites·22 claims
- 0784US6162301AMethods and apparatus for cleaning semiconductor substrates after polishing of copper filmLAM RES CORP·Filed 1999·Granted Dec 19, 2000·56 cites·15 claims
- 0880US12119218B2Sacrificial protection layer for environmentally sensitive surfaces of substratesLAM RES CORP·Filed 2020·Granted Oct 15, 2024·1 cites·20 claims
- 0980US6165956AMethods and apparatus for cleaning semiconductor substrates after polishing of copper filmLAM RES CORP·Filed 1997·Granted Dec 26, 2000·46 cites·1 claims
- 1078US6358847B1Method for enabling conventional wire bonding to copper-based bond pad featuresLAM RES CORP·Filed 1999·Granted Mar 19, 2002·48 cites·33 claims
- 1176US5868863AMethod and apparatus for cleaning of semiconductor substrates using hydrofluoric acid (HF)ONTRAK SYSTEMS INC·Filed 1997·Granted Feb 9, 1999·34 cites·13 claims
- 1275US6319330B1Method and apparatus for cleaning low K dielectric and metal wafer surfacesLAM RES CORP·Filed 2000·Granted Nov 20, 2001·16 cites·10 claims
- 1375US6277203B1Method and apparatus for cleaning low K dielectric and metal wafer surfacesLAM RES CORP·Filed 1998·Granted Aug 21, 2001·43 cites·10 claims
- 1474US5858109AMethod and apparatus for cleaning of semiconductor substrates using standard clean 1 (SC1)ONTRAK SYSTEMS INC·Filed 1997·Granted Jan 12, 1999·38 cites·11 claims
- 1574US2024429040A1Sacrificial protection layer for environmentally sensitive surfaces of substratesLAM RES CORP·Filed 2024·Application pending·0 cites
- 1672US6479443B1Cleaning solution and method for cleaning semiconductor substrates after polishing of copper filmLAM RES CORP·Filed 2000·Granted Nov 12, 2002·15 cites·5 claims
- 1769US6927198B2Methods and apparatus for cleaning semiconductor substrates after polishing of copper filmLAM RES CORP·Filed 2003·Granted Aug 9, 2005·9 cites·26 claims
- 1869US6610601B2Bond pad and wire bondLAM RES CORP·Filed 2002·Granted Aug 26, 2003·15 cites·15 claims
- 1963US6294027B1Methods and apparatus for cleaning semiconductor substrates after polishing of copper filmLAM RES CORP·Filed 1999·Granted Sep 25, 2001·26 cites·16 claims
- 2060US8328942B2Wafer heating and temperature control by backside fluid injectionMOORING BEN·Filed 2004·Granted Dec 11, 2012·7 cites·23 claims
- 2160US7135098B2Copper interconnect seed layer treatment methods and apparatuses for treating the sameLAM RES CORP·Filed 2002·Granted Nov 14, 2006·3 cites·10 claims
- 2258US6666326B2Reinforced chemical mechanical planarization beltLAM RES CORP·Filed 2002·Granted Dec 23, 2003·6 cites·24 claims
- 2358US6593282B1Cleaning solutions for semiconductor substrates after polishing of copper filmLAM RES CORP·Filed 1998·Granted Jul 15, 2003·21 cites·11 claims
- 2454US12322588B2Stimulus responsive polymer films and formulationsLAM RES CORP·Filed 2020·Granted Jun 3, 2025·0 cites·22 claims
- 2552US6324715B1Apparatus for cleaning semiconductor substratesLAM RES CORP·Filed 1999·Granted Dec 4, 2001·14 cites·8 claims
- 2652US2025132195A1Methods and formulations for sacrificial bracing, surface protection, and queue-time management using stimulus responsive polymersLAM RES CORP·Filed 2022·Application pending·0 cites
- 2749US8591665B2Wafer heating and temperature control by backside fluid injectionMOORING BEN·Filed 2012·Granted Nov 26, 2013·0 cites·17 claims
- 2848US9666427B2Method of collapse-free drying of high aspect ratio structuresLAM RES CORP·Filed 2013·Granted May 30, 2017·0 cites·19 claims
- 2947US2024312778A1Temporary capping material for oxide prevention in low temperature direct metal-metal bondingLAM RES CORP·Filed 2021·Application pending·0 cites
- 3047US2023178364A1Removable cvd polymer film for surface protection and queue period extensionLAM RES CORP·Filed 2021·Application pending·0 cites
- 3147US2023207305A1Residue-free removal of stimulus responsive polymers from substratesLAM RES CORP·Filed 2021·Application pending·0 cites
- 3247US2023295412A1Low ceiling temperature homopolymers as sacrificial protection layers for environmentally sensitive substratesLAM RES CORP·Filed 2021·Application pending·0 cites
- 3346US6145148AMethod and apparatus for cleaning of semiconductor substrates using hydrofluoric acid (HF)LAM RES CORP·Filed 1999·Granted Nov 14, 2000·8 cites·13 claims
- 3444US2022328338A1Small molecule films for sacrificial bracing, surface protection, and queue-time managementLAM RES CORP·Filed 2020·Application pending·0 cites
- 3544US2016042945A1Coverage of high aspect ratio features using spin-on dielectric through a wetted surface without a prior drying stepLAM RES CORP·Filed 2014·Application pending·0 cites
- 3642US2017073815A1Method for a non-aqueous electroless polyol deposition of metal or metal alloy in features of a substrateLAM RES CORP·Filed 2015·Application pending·0 cites
- 3741US2014179097A1Deposition apparatus and methodLAM RES CORP·Filed 2012·Application pending·0 cites
- 3840US2004089520A1Reinforced chemical mechanical planarization beltLAM RES CORP·Filed 2003·Application pending·0 cites
- 3940US2002077260A1Cleaning solution and method for cleaning semiconductor substrates after polishing of copper filmFiled 2001·Application pending·0 cites
- 4036US2003186630A1Reinforced chemical mechanical planarization beltLAM RES CORP·Filed 2002·Application pending·0 cites
- 4134US2005261150A1Reactive fluid systems for removing deposition materials and methods for using sameBATTELLE MEMORIAL INST A PART·Filed 2004·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →