Inventor · disambiguated record
Tasi-Jung Wu
Also filed as: WU TASI-JUNG
9 granted patents·38 citations·filing 2012–2020
84Inventor score
Top patents by PatentIndex Score
9 records- 0197US9748190B2Low cost and ultra-thin chip on wafer on substrate (CoWoS) formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 29, 2017·25 cites·21 claims
- 0287US9252110B2Interconnect structure and method of forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 2, 2016·6 cites·20 claims
- 0383US9006101B2Interconnect structure and methodCHEN HSIN-YU·Filed 2012·Granted Apr 14, 2015·6 cites·19 claims
- 0472US11728296B2Interconnect structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 15, 2023·0 cites·20 claims
- 0570US9679859B2Interconnect structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 13, 2017·1 cites·19 claims
- 0658US10811374B2Interconnect structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 20, 2020·0 cites·20 claims
- 0757US10157866B2Interconnect structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·0 cites·20 claims
- 0853US8951838B2Low cost and ultra-thin chip on wafer on substrate (CoWoS) formationTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 10, 2015·0 cites·20 claims
- 0949US9953920B2Interconnect structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 24, 2018·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →