Inventor · disambiguated record
Jui-Hsien Chang
Also filed as: CHANG JUI-HSIEN
17 granted patents·22 pending applications·127 citations·filing 2004–2020
93Inventor score
Files withADVANCED CHIP ENG TECH INC30EPISTAR CORP4PHISON ELECTRONICS CORP2ADAVANCED CHIP ENGINEERING TEC1YANG JIUNN-YEONG1
Top patents by PatentIndex Score
39 records- 0189US7279782B2FBGA and COB package structure for image sensorADVANCED CHIP ENG TECH INC·Filed 2005·Granted Oct 9, 2007·21 cites·25 claims
- 0288US7459729B2Semiconductor image device package with die receiving through-hole and method of the sameADVANCED CHIP ENG TECH INC·Filed 2006·Granted Dec 2, 2008·16 cites·11 claims
- 0387US7423335B2Sensor module package structure and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Granted Sep 9, 2008·15 cites·19 claims
- 0483US7566854B2Image sensor moduleADVANCED CHIP ENG TECH INC·Filed 2006·Granted Jul 28, 2009·7 cites·19 claims
- 0582US7335870B1Method for image sensor protectionADVANCED CHIP ENG TECH INC·Filed 2006·Granted Feb 26, 2008·11 cites·8 claims
- 0679US8055873B2Data writing method for flash memory, and controller and system using the samePHISON ELECTRONICS CORP·Filed 2008·Granted Nov 8, 2011·11 cites·16 claims
- 0779US7176567B2Semiconductor device protective structure and method for fabricating the sameADVANCED CHIP ENG TECH INC·Filed 2005·Granted Feb 13, 2007·10 cites·8 claims
- 0878US7342296B2Wafer street buffer layerADVANCED CHIP ENG TECH INC·Filed 2005·Granted Mar 11, 2008·8 cites·10 claims
- 0974US8606987B2Data writing method for flash memory and controller using the sameYANG JIUNN-YEONG·Filed 2008·Granted Dec 10, 2013·8 cites·20 claims
- 1073US9917075B2Light-emitting device and the method of manufacturing the sameEPISTAR CORP·Filed 2014·Granted Mar 13, 2018·2 cites·14 claims
- 1171US7416920B2Semiconductor device protective structure and method for fabricating the sameADVANCED CHIP ENG TECH INC·Filed 2006·Granted Aug 26, 2008·5 cites·12 claims
- 1268US11107797B2Light-emitting device and the method of manufacturing the sameEPISTAR CORP·Filed 2020·Granted Aug 31, 2021·0 cites·10 claims
- 1368US7498556B2Image sensor module having build-in package cavity and the method of the sameADAVANCED CHIP ENGINEERING TEC·Filed 2007·Granted Mar 3, 2009·6 cites·15 claims
- 1460US7863105B2Image sensor package and forming method of the sameADVANCED CHIP ENG TECH INC·Filed 2008·Granted Jan 4, 2011·0 cites·8 claims
- 1559US7525139B2Image sensor with a protection layerADVANCED CHIP ENG TECH INC·Filed 2004·Granted Apr 28, 2009·7 cites·8 claims
- 1657US2008274579A1Wafer level image sensor package with die receiving cavity and method of making the sameADVANCED CHIP ENG TECH INC·Filed 2008·Application pending·0 cites
- 1756US10756067B2Light-emitting device and the method of manufacturing the sameEPISTAR CORP·Filed 2018·Granted Aug 25, 2020·0 cites·7 claims
- 1855US2008136012A1Imagine sensor package and forming method of the sameADVANCED CHIP ENG TECH INC·Filed 2006·Application pending·0 cites
- 1954US2008197435A1Wafer level image sensor package with die receiving cavity and method of making the sameADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 2052US2008268647A1Method of plasma etching with pattern maskADVANCED CHIP ENG TECH INC·Filed 2008·Application pending·0 cites
- 2150US2008261346A1Semiconductor image device package with die receiving through-hole and method of the sameYANG WEN-KUN·Filed 2008·Application pending·0 cites
- 2249US2008029877A1Method for separating package of wlpADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 2349US2008116169A1Method and structure of pattern mask for dry etchingADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 2448US2008118707A1Method and structure of pattern mask for dry etchingADVANCED CHIP ENG TECH INC·Filed 2006·Application pending·0 cites
- 2548US2010042774A1Block management method for flash memory, and storage system and controller using the samePHISON ELECTRONICS CORP·Filed 2008·Application pending·0 cites
- 2648US2007262051A1Method of plasma etching with pattern maskADVANCED CHIP ENG TECH INC·Filed 2006·Application pending·0 cites
- 2747US2008308307A1Trace structure and method for fabricating the sameADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 2846US2007072338A1Method for separating package of WLPADVANCED CHIP ENG TECH INC·Filed 2005·Application pending·0 cites
- 2945US2008191335A1Cmos image sensor chip scale package with die receiving opening and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 3044US2008157398A1Semiconductor device package having pseudo chipsADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 3144US2009166873A1Inter-connecting structure for semiconductor device package and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 3244US2008211075A1Image sensor chip scale package having inter-adhesion with gap and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 3344US2009008729A1Image sensor package utilizing a removable protection film and method of making the sameADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 3443US2008191297A1Wafer level image sensor package with die receiving cavity and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 3543US2008116564A1Wafer level package with die receiving cavity and method of the sameADVANCED CHIP ENG TECH INC·Filed 2006·Application pending·0 cites
- 3643US2008083980A1Cmos image sensor chip scale package with die receiving through-hole and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 3742US2008191333A1Image sensor package with die receiving opening and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 3841US2008173792A1Image sensor module and the method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 3936US10217904B2Light-emitting device with metallized mounting support structureEPISTAR CORP·Filed 2016·Granted Feb 26, 2019·0 cites·19 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →